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NB100ELT23LDG

Onsemi

NB100ELT23LDG by Onsemi

NB100ELT23LDG by Onsemi is a voltage level translator with 2 functions, operating at 3.3V. It has a max delay of 3.25ns and interfaces as a PECL to TTL translator. Ideal for industrial applications requiring precise signal translation in compact spaces.

Median Price

$7.942

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 12,500 parts In-Stock

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12,500

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Rochester

USA . 11,826 parts In-Stock

1+ parts

-

100+ parts

$7.060

1k+ parts

$6.320

10k+ parts

$5.940

11,826

-

$7.060

$6.320

$5.940

Verical

USA . 9,212 parts In-Stock

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-

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$8.825

1k+ parts

$7.900

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9,212

-

$8.825

$7.900

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Distributors (In-Stock)

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Digiode

USA . 1,328 parts In-Stock

1+ parts

$2.508

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1,328

$2.508

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Flip Electronics

USA . 12,500 parts In-Stock

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Vyrian

USA . 7,445 parts In-Stock

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Zilex Electronics Inc.

Canada . 784 parts In-Stock

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Elcom Components

USA . 29 parts In-Stock

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Corohmni

South Africa . 339 parts In-Stock

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$2.320

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339

$2.320

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Corphita

USA . 1,962 parts In-Stock

1+ parts

$2.376

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1,962

$2.376

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AZTECH Wire

Italy . 595 parts In-Stock

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$18.190

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595

$18.190

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Continental Prestige Electronics

USA . 11,826 parts In-Stock

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$2.200

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TANS Electronics

Latvia . 6,968 parts In-Stock

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SupplyDigital Components

Austria . 5,411 parts In-Stock

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Problanco Electronics

Mexico . 3,358 parts In-Stock

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Kulean Microsystems

USA . 2,724 parts In-Stock

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UHIMA Technologies

Türkiye . 914 parts In-Stock

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Microchip USA

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Kepictronics

USA . 69 parts In-Stock

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Overview

Elevate your voltage level translation needs with the NB100ELT23LDG by Onsemi. Crafted by a trusted manufacturer, this versatile product falls under the category of voltage level translators and offers seamless communication between different technologies. With a small outline package style and industrial-grade durability, this device ensures reliable performance in a wide range of applications. Experience the benefits of true output polarity and fast operation, making it an essential component for your electronic projects. Invest in quality and innovation with the NB100ELT23LDG - your gateway to efficient and responsive voltage level translation solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside the package, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of systems and devices that operate within this voltage range.

No. of Functions: 2

Multiple functions in a single device offer versatility and efficiency in voltage translation tasks.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme low-temperature environments, making it suitable for various industrial applications.

Maximum Delay: 3.25 ns

Provides fast signal translation with minimal delay, ensuring efficient performance in high-speed applications.

Technical Specifications

Voltage Level Translators NB100ELT23LDG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.25 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NB100ELT23LDG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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