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NB100ELT23LDTR2G

Onsemi

NB100ELT23LDTR2G by Onsemi

NB100ELT23LDTR2G by Onsemi is a voltage level translator with 3.3V power supply, 3.6V max supply voltage, and 3.25ns max delay. It is ideal for PECL to TTL translation in industrial applications due to its ECL technology, dual terminals, and compact square package design.

Median Price

$4.680

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,280 parts In-Stock

1+ parts

$4.680

100+ parts

$2.965

1k+ parts

$2.907

10k+ parts

$2.580

4,280

$4.680

$2.965

$2.907

$2.580

Mouser Electronics

USA . 1,747 parts In-Stock

1+ parts

$4.680

100+ parts

$2.970

1k+ parts

$2.660

10k+ parts

$2.570

1,747

$4.680

$2.970

$2.660

$2.570

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 642 parts In-Stock

1+ parts

$5.292

100+ parts

-

1k+ parts

-

10k+ parts

-

642

$5.292

-

-

-

Vyrian

USA . 1,409 parts In-Stock

1+ parts

$5.570

100+ parts

-

1k+ parts

-

10k+ parts

-

1,409

$5.570

-

-

-

Flip Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Connector Distribution Corp

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Right Parts Inc.

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 148 parts In-Stock

1+ parts

$5.013

100+ parts

-

1k+ parts

-

10k+ parts

-

148

$5.013

-

-

-

Corohmni

South Africa . 336 parts In-Stock

1+ parts

$5.570

100+ parts

-

1k+ parts

-

10k+ parts

-

336

$5.570

-

-

-

SupplyDigital Components

Austria . 6,754 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,754

-

-

-

-

Problanco Electronics

Mexico . 6,598 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,598

-

-

-

-

Kulean Microsystems

USA . 4,708 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,708

-

-

-

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,500

-

-

-

-

Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

-

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TANS Electronics

Latvia . 806 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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806

-

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UHIMA Technologies

Türkiye . 705 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

705

-

-

-

-

Overview

Discover the NB100ELT23LDTR2G by Onsemi, a top-quality voltage level translator designed to meet your diverse electronic needs. Onsemi, known for its cutting-edge technology and reliability, delivers a product that excels in performance and precision. Ideal for various applications, this voltage level translator offers seamless communication between different voltage systems, ensuring smooth operation and optimal efficiency. Experience the value and benefits of this innovative product and elevate your projects to new heights with the NB100ELT23LDTR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good durability and can withstand harsh environmental conditions.

Surface Mount: YES

Surface mount design allows for easy and secure installation on circuit boards.

Maximum Supply Voltage: 3.6V

Supports a high maximum supply voltage, making it suitable for a wide range of applications.

No. of Functions: 2

Having 2 functions in one device increases efficiency and saves space on the circuit board.

Package Shape: SQUARE

Square package shape fits well in tight spaces and allows for efficient layout on the board.

Power Supplies (V): 3.3

Operates at a common power supply voltage, making it compatible with many systems.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity and improves signal transmission.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the board, while thin profile reduces overall height of the component.

Minimum Supply Voltage: 3V

Can operate at a low minimum supply voltage, ensuring compatibility with a variety of systems.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without compromising performance, ideal for industrial environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, making it versatile for various applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and ensures reliable connections.

Maximum Seated Height: 1.1 mm

Compact and low profile design saves space in the overall circuit layout.

Width: 3 mm

Narrow width allows for efficient layout of components on the circuit board.

Output Polarity: TRUE

True output polarity ensures accurate signal conversion and transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient amount of time during soldering process.

Peak Reflow Temperature °C: 260

Can withstand high peak reflow temperatures during soldering without damage.

Length: 3 mm

Compact length allows for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Technology: ECL

Uses Emitter-Coupled Logic technology for fast signal conversion and high performance.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering process and provides secure connections.

Nominal Supply Voltage: 3.3 V

Operates at a common nominal supply voltage, ensuring compatibility with various systems.

Maximum Delay: 3.25 ns

Low maximum delay ensures fast signal conversion and transmission.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high density mounting on the circuit board.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate resistance to moisture, suitable for most environments.

Interface IC Type: PECL TO TTL TRANSLATOR

Specific interface type for translating PECL to TTL signals, ideal for certain applications requiring this conversion.

Technical Specifications

Voltage Level Translators NB100ELT23LDTR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.25 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB100ELT23LDTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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