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NB100ELT23LDT

Onsemi

NB100ELT23LDT by Onsemi

NB100ELT23LDT by Onsemi is a voltage level translator with 2 functions, operating at 3.3V. It features a max delay of 3.25ns and interface IC type PECL to TTL Translator. Ideal for industrial applications requiring precise signal translation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,618 parts In-Stock

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Digiode

USA . 2,399 parts In-Stock

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2,399

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AZTECH Wire

Italy . 1,064 parts In-Stock

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$18.060

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QUARKTWIN TECHNOLOGY LTD

USA . 20,408 parts In-Stock

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TANS Electronics

Latvia . 7,304 parts In-Stock

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Kulean Microsystems

USA . 6,295 parts In-Stock

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6,295

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SupplyDigital Components

Austria . 6,294 parts In-Stock

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6,294

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Problanco Electronics

Mexico . 6,154 parts In-Stock

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UHIMA Technologies

Türkiye . 921 parts In-Stock

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Microchip USA

USA . 378 parts In-Stock

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Corphita

USA . 247 parts In-Stock

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Corohmni

South Africa . 198 parts In-Stock

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Overview

Enhance your electronic designs with the NB100ELT23LDT voltage level translator from Onsemi, a trusted manufacturer known for its quality products. This versatile device is perfect for a wide range of applications, offering seamless translation between PECL and TTL signals. With a compact design and top-notch performance, this voltage translator ensures reliable signal integrity and smooth operation. Upgrade your projects today with the NB100ELT23LDT and experience the superior value and benefits it brings to your circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the product is long-lasting and reliable.

Surface Mount: YES

Being surface mountable, this product is easy to install on PCBs, saving space and allowing for efficient manufacturing processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage capability of 3.6V provides flexibility and compatibility with a wide range of systems and applications.

No. of Functions: 2

With dual functions, this voltage level translator can handle multiple signals or tasks simultaneously, enhancing its versatility and functionality.

Package Shape: SQUARE

The square package shape allows for easy mounting and alignment on PCBs, ensuring efficient installation and integration within electronic systems.

Power Supplies (V): 3.3

Operates at a standard power supply voltage of 3.3V, making it suitable for a wide range of applications and compatible with common power sources.

No. of Terminals: 8

With 8 terminals, this product offers a sufficient number of connection points for input and output signals, allowing for versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design of the package make it compact and space-saving, ideal for applications with limited board space.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement of 3V ensures efficient power consumption and compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand elevated temperatures and harsh operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable performance even in cold environments or during temperature fluctuations.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring secure and reliable connections during installation and operation.

Terminal Position: DUAL

Dual terminal positions enable flexible installation and connection options, accommodating different PCB layouts and signal routing requirements.

Maximum Seated Height: 1.1 mm

With a low maximum seated height of 1.1mm, this product is suitable for compact designs and applications with height restrictions.

Width: 3 mm

The narrow width of 3mm allows for efficient use of space on the PCB, enabling compact and streamlined circuit layouts.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with various input/output configurations, enhancing the product's reliability and performance.

Peak Reflow Temperature °C: 235

The high peak reflow temperature of 235 °C allows for reliable and secure soldering during manufacturing processes, ensuring product integrity.

Length: 3 mm

The short length of 3mm contributes to the compact size and space-saving design of the product, making it suitable for applications with tight constraints.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh industrial environments with temperature variations and fluctuations.

Technology: ECL

Utilizing ECL technology provides high-speed performance and noise immunity, making it suitable for applications requiring fast signal processing and stability.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy installation and soldering on PCBs, ensuring secure and reliable connections for optimal performance.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures consistent and stable power delivery, enhancing the product's reliability and compatibility.

Maximum Delay: 3.25 ns

With a low maximum delay of 3.25ns, this voltage level translator provides fast signal transmission and minimal latency, ideal for high-speed applications.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for dense packing and precise PCB layouts, making the product suitable for compact and high-density designs.

Interface IC Type: PECL TO TTL TRANSLATOR

Designed for translating signals from PECL to TTL interface IC types, this product offers compatibility and signal conversion capabilities for diverse electronic systems.

Technical Specifications

Voltage Level Translators NB100ELT23LDT attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.25 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

NB100ELT23LDT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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