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SN74GTL2107PW

Texas Instruments

SN74GTL2107PW by Texas Instruments

SN74GTL2107PW by Texas Instruments is a voltage level translator with 13 functions, operating at 3.3V. It features a max supply voltage of 3.6V and can handle industrial temperature grades up to 85°C. Ideal for GTL to TTL transceiver applications due to its BICMOS technology and compact design with small outline package style.

Median Price

$1.863

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 41,950 parts In-Stock

1+ parts

$2.296

100+ parts

$1.896

1k+ parts

$1.025

10k+ parts

-

41,950

$2.296

$1.896

$1.025

-

Rochester

USA . 32,169 parts In-Stock

1+ parts

-

100+ parts

$1.660

1k+ parts

$1.490

10k+ parts

$1.400

32,169

-

$1.660

$1.490

$1.400

DigiKey

USA . 32,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.190

10k+ parts

-

32,169

-

-

$2.190

-

Verical

USA . 15,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.863

10k+ parts

$1.750

15,500

-

-

$1.863

$1.750

Arrow

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$1.190

1k+ parts

-

10k+ parts

-

50

-

$1.190

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 384 parts In-Stock

1+ parts

$1.269

100+ parts

-

1k+ parts

-

10k+ parts

-

384

$1.269

-

-

-

Digiode

USA . 3,371 parts In-Stock

1+ parts

$1.349

100+ parts

-

1k+ parts

-

10k+ parts

-

3,371

$1.349

-

-

-

DigiKey Marketplace

USA . 42,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

42,283

-

-

-

-

NPI Materials, Inc.

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,072 parts In-Stock

1+ parts

$1.278

100+ parts

-

1k+ parts

-

10k+ parts

-

4,072

$1.278

-

-

-

Parana Technologies

USA . 892 parts In-Stock

1+ parts

$1.889

100+ parts

-

1k+ parts

$2.431

10k+ parts

-

892

$1.889

-

$2.431

-

DigiPath Technology Company

USA . 123 parts In-Stock

1+ parts

$2.081

100+ parts

$1.914

1k+ parts

-

10k+ parts

-

123

$2.081

$1.914

-

-

ChromeModa Solutions

Germany . 4,244 parts In-Stock

1+ parts

$2.123

100+ parts

$1.741

1k+ parts

-

10k+ parts

-

4,244

$2.123

$1.741

-

-

IDEA Electronic Components Group

UK . 1,749 parts In-Stock

1+ parts

$2.123

100+ parts

-

1k+ parts

$1.911

10k+ parts

-

1,749

$2.123

-

$1.911

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,000

-

-

-

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A-Z Elektronik GmbH

Germany . 5,910 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,910

-

-

-

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Perfect Parts

USA . 336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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336

-

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Overview

Upgrade your voltage level translation solutions with the SN74GTL2107PW by Texas Instruments, a high-quality product designed to meet your unique needs. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust that this voltage level translator will deliver reliable performance. Ideal for a wide range of applications, this product offers value, efficiency, and convenience to customers looking to enhance their electronic designs. Trust Texas Instruments to provide innovative solutions that meet and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight construction for the voltage level translator.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle a high supply voltage to accommodate various applications.

No. of Functions: 13

Offers multiple functions in a single device for enhanced versatility.

Package Shape: RECTANGULAR

Facilitates easy integration into circuit layouts.

Power Supplies (V): 3.3

Operates efficiently at a standard power supply voltage.

No. of Terminals: 28

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables space-saving design and efficient heat dissipation.

Minimum Supply Voltage: 3 V

Ensures reliable operation even at lower supply voltages.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures for extended use.

Output Characteristics: 3-STATE

Allows for high impedance output states when not actively transmitting signals.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

Offers flexible terminal configurations for different circuit layouts.

Maximum Seated Height: 1.2 mm

Low profile design for compact and efficient circuit board layout.

Width: 4.4 mm

Compact width for space-saving integration.

Output Polarity: TRUE

Provides accurate signal polarity translation.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high reflow temperatures for soldering without damage.

Peak Reflow Temperature °C: 260

Can endure high reflow temperatures during manufacturing processes.

Length: 9.7 mm

Compact length for space-efficient circuit board layout.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

No. of Channels: 12

Multiple channels for data transmission and processing.

Technology: BICMOS

Utilizes BiCMOS technology for efficient performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable solder connections.

Maximum Supply Current: 12 mA

Low supply current requirement for efficient power management.

Input Characteristics: STANDARD

Conforms to standard input characteristics for compatibility with various systems.

Nominal Supply Voltage: 3.3 V

Operates at a standard supply voltage for compatibility with other components.

Maximum Delay: 10 ns

Low delay time for fast signal transmission.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact design and space-saving layout.

Interface IC Type: GTL TO TTL TRANSCEIVER

Enables communication between devices with different voltage levels.

Technical Specifications

Voltage Level Translators SN74GTL2107PW attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

10 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Channels:

12

No. of Functions:

13

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74GTL2107PW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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