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SN74GTL2006PWE4

Texas Instruments

SN74GTL2006PWE4 by Texas Instruments

SN74GTL2006PWE4 by Texas Instruments is a voltage level translator with 13 functions, operating at 3.3V. It features a max supply voltage of 3.6V, terminal finish in nickel palladium gold, and BICMOS technology. Ideal for GTL to TTL transceiver applications with an industrial temperature grade range from -40°C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,159 parts In-Stock

1+ parts

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5,159

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Digiode

USA . 620 parts In-Stock

1+ parts

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620

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,170 parts In-Stock

1+ parts

$10.510

100+ parts

-

1k+ parts

$11.021

10k+ parts

-

1,170

$10.510

-

$11.021

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ChromeModa Solutions

Germany . 2,878 parts In-Stock

1+ parts

$11.809

100+ parts

$9.683

1k+ parts

-

10k+ parts

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2,878

$11.809

$9.683

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IDEA Electronic Components Group

UK . 588 parts In-Stock

1+ parts

$11.809

100+ parts

$11.219

1k+ parts

$10.628

10k+ parts

-

588

$11.809

$11.219

$10.628

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AZTECH Wire

Italy . 245 parts In-Stock

1+ parts

$11.996

100+ parts

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245

$11.996

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One Stop Electronics

USA . 1,456 parts In-Stock

1+ parts

$36.500

100+ parts

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1,456

$36.500

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Corphita

USA . 4,693 parts In-Stock

1+ parts

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4,693

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DigiPath Technology Company

USA . 1,351 parts In-Stock

1+ parts

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100+ parts

$10.647

1k+ parts

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1,351

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$10.647

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Microchip USA

USA . 150 parts In-Stock

1+ parts

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150

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Overview

Upgrade your voltage level translation game with the SN74GTL2006PWE4 by Texas Instruments. Designed with precision and quality in mind, this voltage level translator offers seamless communication between different voltage domains. Perfect for industrial applications, this product ensures reliable and efficient performance. Say goodbye to compatibility issues and hello to smooth operations with the SN74GTL2006PWE4. Trust Texas Instruments for top-notch products that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making this product reliable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

Ability to handle up to 3.6V supply voltage ensures compatibility with a wide range of devices and systems.

No. of Functions: 13

With 13 functions, this product offers versatility and flexibility in voltage translation tasks, meeting diverse application requirements.

Package Shape: RECTANGULAR

Rectangular shape of the package allows for easy integration into circuit designs and efficient use of board space.

Power Supplies (V): 3.3

Operating at 3.3V nominal supply voltage ensures compatibility with common power sources and reduces the need for additional voltage regulation circuitry.

No. of Terminals: 28

With 28 terminals, this product offers sufficient connectivity options for complex circuits and systems, enabling efficient signal routing.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch package style contributes to space-saving design, making this product ideal for compact applications.

Minimum Supply Voltage: 3 V

Ability to operate at a minimum supply voltage of 3V ensures reliable performance even under low voltage conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows this product to function reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures this product can operate in cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the reliability and longevity of the product.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting orientations and allows for easier circuit layout and routing.

Maximum Seated Height: 1.2 mm

Low maximum seated height of 1.2mm contributes to a low-profile design, suitable for applications with space constraints.

Width: 4.4 mm

Narrow width of 4.4mm enables compact integration into circuit boards and facilitates dense component placement.

Output Polarity: TRUE

True output polarity ensures accurate signal translation and compatibility with various logic levels.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this product is easy to solder and ensures reliable connections during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper soldering and robust connections for industrial applications.

Length: 9.7 mm

Optimal length of 9.7mm allows for efficient board layout and space utilization in circuit designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures this product can operate reliably in harsh industrial environments without performance degradation.

Technology: BICMOS

BICMOS technology offers a balance of bipolar and CMOS characteristics, providing high-speed performance and low power consumption for efficient signal translation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy surface mount soldering and robust mechanical connections for reliable operation.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and simplifies voltage level translation tasks.

Maximum Delay: 10 ns

Low maximum delay of 10 nanoseconds ensures fast signal translation, making this product suitable for high-speed applications.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm enables high-density mounting and efficient signal routing in compact circuit designs.

Interface IC Type: GTL TO TTL TRANSCEIVER

GTL to TTL transceiver interface IC type offers seamless compatibility and signal translation between different logic levels, making this product versatile for various applications.

Technical Specifications

Voltage Level Translators SN74GTL2006PWE4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

10 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

13

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74GTL2006PWE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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