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MC10ELT21MNR4

Onsemi

MC10ELT21MNR4 by Onsemi

MC10ELT21MNR4 by Onsemi is a voltage level translator with max supply voltage of 5.25V, operating temp range -40 to 85 °C. It has PECL to TTL translation interface, delay of 5.5ns, and is ideal for industrial applications requiring ECL technology.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 1,919 parts In-Stock

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Digiode

USA . 1,909 parts In-Stock

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Problanco Electronics

Mexico . 7,924 parts In-Stock

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TANS Electronics

Latvia . 610 parts In-Stock

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Corphita

USA . 582 parts In-Stock

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Corohmni

South Africa . 385 parts In-Stock

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SupplyDigital Components

Austria . 166 parts In-Stock

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UHIMA Technologies

Türkiye . 76 parts In-Stock

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Kulean Microsystems

USA . 55 parts In-Stock

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Overview

Elevate your voltage level translation needs with the MC10ELT21MNR4 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that guarantee reliability and performance. This voltage translator is perfect for a wide range of applications, offering seamless integration and efficient signal conversion. Say goodbye to compatibility issues and hello to smooth operations with this cutting-edge technology. Upgrade your systems today with the MC10ELT21MNR4 and experience the difference in quality and performance.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy and convenient installation on a circuit board, saving space and making assembly simpler.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this voltage level translator can handle a wide range of input voltages, providing versatility in different applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, leading to a more compact and organized layout.

Power Supplies (V): 5

Operating at a standard 5V power supply, this voltage level translator is compatible with many existing systems and components.

No. of Terminals: 8

Having 8 terminals allows for sufficient connectivity options and versatility in connecting to other components in the circuit.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style ensures efficient heat dissipation and space-saving on the board.

Minimum Supply Voltage: 4.75 V

With a low minimum supply voltage, this voltage level translator can still function reliably even when the input power is slightly lower than usual.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance makes this product suitable for industrial environments where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this voltage level translator can withstand cold conditions without impacting performance.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good conductivity and solderability, ensuring reliable connections in the circuit.

Terminal Position: DUAL

The dual terminal position allows for flexibility in the orientation of the component during installation, making it easier to integrate into different circuit layouts.

Maximum Seated Height: 1 mm

The low maximum seated height helps in maintaining a compact design on the circuit board, preventing interference with other components.

Width: 2 mm

The narrow width of 2mm contributes to the overall space-saving design of this voltage level translator, enabling compact and efficient circuit layouts.

Output Polarity: TRUE

The true output polarity ensures that the output signal accurately reflects the input signal, leading to reliable and consistent voltage translation.

Length: 2 mm

The short length of 2mm further enhances the compactness of this voltage level translator, making it suitable for applications with limited space.

Temperature Grade: INDUSTRIAL

Being designed for industrial temperature requirements, this voltage level translator can operate effectively in harsh environments with varying temperature conditions.

Technology: ECL

Utilizing ECL technology ensures high-speed operation and low power consumption, making this voltage level translator suitable for high-performance applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the installation process and reduces the risk of solder joints cracking, ensuring long-term reliability.

Nominal Supply Voltage: 5 V

Operating at a standard 5V nominal supply voltage, this voltage level translator is compatible with a wide range of systems and components.

Maximum Delay: 5.5 ns

With a low maximum delay of 5.5 nanoseconds, this voltage level translator can quickly and accurately translate input signals to output signals, minimizing signal distortion.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for close spacing of terminals on the circuit board, enabling high-density integration and compact layouts.

Interface IC Type: PECL TO TTL TRANSLATOR

The PECL to TTL translator interface IC type enables seamless communication between different logic levels, expanding compatibility and usability in various applications.

Technical Specifications

Voltage Level Translators MC10ELT21MNR4 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

5.5 ns

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

2 mm

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC10ELT21MNR4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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