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10525M/B2AJC

Onsemi

10525M/B2AJC by Onsemi

10525M/B2AJC by Onsemi is a voltage level translator with 4 functions, MIL-STD-883 screening, and TOTEM-POLE output. Ideal for ECL to TTL translation in military-grade applications. Operates b/w -55 °C to 125°C, with 16 terminals in a chip carrier package.

Median Price

$40.586

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 133 parts In-Stock

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$40.586

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$42.616

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Digiode

USA . 743 parts In-Stock

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Prism Electronics

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Native Components

USA . 841 parts In-Stock

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$0.824

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Northwest PG Solutions

USA . 1,033 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 151 parts In-Stock

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SupplyDigital Components

Austria . 5,289 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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Overview

Elevate your voltage level translation needs with the 10525M/B2AJC by Onsemi. Designed for high-performance applications, this voltage translator boasts MIL-STD-883 screening and a robust chip carrier package for reliability in extreme conditions. With 4 functions and true totem-pole output characteristics, this product seamlessly bridges ECL to TTL interfaces with ease. Trust in Onsemi's reputation for quality and innovation to deliver unparalleled value and efficiency to your projects. Experience seamless integration and enhanced performance with the 10525M/B2AJC - the ultimate solution for your voltage level translation requirements.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and convenient installation on circuit boards, saving space and simplifying the overall design.

No. of Functions: 4

Having 4 functions in one device provides versatility and flexibility in voltage level translation applications.

Screening Level: MIL-STD-883

MIL-STD-883 screening ensures high reliability and quality performance in difficult operating conditions, making it suitable for military or aerospace applications.

Package Shape: SQUARE

Square package shape makes it easier to handle and mount on circuit boards compared to irregular shapes, ensuring proper alignment and connectivity.

No. of Bits: 4

With 4 bits, this voltage level translator can handle multiple data lines simultaneously, providing efficient data transmission.

No. of Terminals: 16

16 terminals allow for more connections and interfaces, enabling compatibility with a wide range of devices and systems.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is compact and lightweight, suitable for high-density applications and enhancing portability.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this voltage level translator can withstand high-temperature environments without compromising performance.

Output Characteristics: TOTEM-POLE

Totem-pole output characteristics ensure strong and reliable signal output, making it suitable for demanding applications requiring stable voltage translation.

Minimum Operating Temperature: -55 °C

Operating at temperatures as low as -55 °C allows this device to function in harsh cold environments, expanding its range of applications.

Terminal Position: QUAD

Quad terminal position enhances ease of connection and compatibility with standard quad configurations, simplifying integration into existing systems.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission without inversion or distortion, maintaining data integrity in voltage level translation.

Temperature Grade: MILITARY

Military-grade temperature tolerance and reliability make this voltage level translator ideal for rugged military applications where performance under extreme conditions is crucial.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of soldering errors and enhances signal integrity, ensuring reliable connections in critical voltage translation tasks.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes this device compatible with standard voltage levels in many electronic systems, simplifying integration and use.

Nominal Negative Supply Voltage: -5.2 V

Nominal negative supply voltage of -5.2V allows bidirectional voltage translation with negative logic levels, expanding the versatility and applicability of this device.

Interface IC Type: ECL TO TTL TRANSLATOR

The ECL to TTL translator interface IC type ensures seamless communication and compatibility between ECL and TTL logic devices, facilitating data exchange in mixed-signal systems.

Technical Specifications

Voltage Level Translators 10525M/B2AJC attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

10525M/B2AJC Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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