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10525/BEAJC

Onsemi

10525/BEAJC by Onsemi

10525/BEAJC by Onsemi is a voltage level translator with 4 functions, MIL-STD-883 screening, and TOTEM-POLE output. It operates b/w -55 °C to 125°C, suitable for military-grade applications. The ECL TO TTL TRANSLATOR interface IC has a nominal voltage of 5V and -5.2V negative supply voltage, with a package style of IN-LINE.

Median Price

$28.547

Lifecycle Status

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Freelance Electronics

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Digiode

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PC Components Company LLC

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Bristol Electronics

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Manoshevitz Elec. Sales

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Native Components

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Northwest PG Solutions

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Corohmni

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Kulean Microsystems

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Overview

Elevate your voltage level translation needs with the 10525/BEAJC by Onsemi. Known for their top-quality products, Onsemi delivers a voltage level translator that boasts MIL-STD-883 screening levels and a temperature range fit for military-grade applications. With its true output polarity and totem-pole characteristics, this versatile translator is ideal for a wide range of functions. Trust in Onsemi to provide reliable solutions that meet the highest standards, ensuring optimal performance and value for all your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability in even harsh operating conditions.

No. of Functions: 4

Having multiple functions in one device increases functionality and saves space in the circuit design.

Screening Level: MIL-STD-883

This high screening level ensures quality and reliability in military applications.

Package Shape: RECTANGULAR

The rectangular shape is easy to integrate into various circuit layouts.

No. of Bits: 4

This product can handle 4-bit data translation efficiently.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options in the circuit.

Maximum Operating Temperature: 125 °C

This high operating temperature range makes the product suitable for various environments.

Output Characteristics: TOTEM-POLE

Totem-pole output ensures strong signal driving capability.

Minimum Operating Temperature: -55 °C

The product can operate in extremely low temperatures without performance issues.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit connections.

Output Polarity: TRUE

True output polarity ensures accurate signal translation.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable performance in tough conditions.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections in the circuit.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage makes integration easier with existing systems.

Nominal Negative Supply Voltage: -5.2 V

Having a negative supply voltage allows for bidirectional signal translation.

Interface IC Type: ECL TO TTL TRANSLATOR

This interface IC type ensures seamless translation between ECL and TTL signal levels.

Technical Specifications

Voltage Level Translators 10525/BEAJC attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-CDIP-T16

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

10525/BEAJC Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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