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MC10H351FNR2G

Onsemi

MC10H351FNR2G by Onsemi

MC10H351FNR2G by Onsemi is a voltage level translator with 4 functions, operating b/w 0-75 °C. It has a supply voltage range of 4.75-5.25 V and offers fast operation with a max delay of 2.2 ns. Ideal for TTL/NMOS to ECL translation applications due to its compact chip carrier package and complementary output polarity.

Median Price

$10.840

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,060 parts In-Stock

1+ parts

-

100+ parts

$10.840

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1,060

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$10.840

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Rochester

USA . 988 parts In-Stock

1+ parts

-

100+ parts

$9.360

1k+ parts

$8.370

10k+ parts

$7.880

988

-

$9.360

$8.370

$7.880

Verical

USA . 509 parts In-Stock

1+ parts

-

100+ parts

$11.700

1k+ parts

$11.088

10k+ parts

-

509

-

$11.700

$11.088

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,237 parts In-Stock

1+ parts

$9.899

100+ parts

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2,237

$9.899

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Vyrian

USA . 2,239 parts In-Stock

1+ parts

$10.420

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2,239

$10.420

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DigiKey Marketplace

USA . 748 parts In-Stock

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748

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North Shore Components

USA . 28 parts In-Stock

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28

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 643 parts In-Stock

1+ parts

$9.378

100+ parts

-

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643

$9.378

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Corohmni

South Africa . 443 parts In-Stock

1+ parts

$10.420

100+ parts

-

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443

$10.420

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QUARKTWIN TECHNOLOGY LTD

USA . 27,109 parts In-Stock

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27,109

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SupplyDigital Components

Austria . 6,863 parts In-Stock

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6,863

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Kulean Microsystems

USA . 3,852 parts In-Stock

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3,852

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TANS Electronics

Latvia . 2,449 parts In-Stock

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2,449

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Problanco Electronics

Mexico . 1,740 parts In-Stock

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1,740

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UHIMA Technologies

Türkiye . 151 parts In-Stock

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151

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Microchip USA

USA . 120 parts In-Stock

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120

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Overview

Elevate your voltage level translation needs with the MC10H351FNR2G by Onsemi. Known for their high-quality products, Onsemi's voltage level translators offer impeccable performance and reliability. Ideal for a variety of applications, this chip carrier package boasts 4 functions and ensures seamless communication between different voltage levels. With a commercial extended temperature grade and fast response time, customers can trust in the value and benefits that this product brings to their projects. Choose Onsemi for precision, efficiency, and peace of mind in your voltage level translation solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY materials provide durability and protection, making this product suitable for various environments.

Surface Mount: YES

Being surface mountable makes this product easy to integrate into modern PCB designs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle a wide range of input voltages, enhancing its versatility.

No. of Functions: 4

Having multiple functions in one package reduces the need for additional components, simplifying circuit design and reducing costs.

Maximum Operating Temperature: 75 °C

The high operating temperature range allows this product to be used in various industrial applications without the risk of overheating.

Output Polarity: COMPLEMENTARY

Complementary output signals provide better noise immunity and signal integrity, making this product suitable for high-speed communication systems.

Nominal Supply Voltage: 5 V

Having a standard 5V supply voltage makes this product compatible with a wide range of existing systems and devices.

Interface IC Type: TTL/NMOS TO ECL TRANSLATOR

This interface IC type allows seamless translation between different logic levels, enabling compatibility between devices using different voltage standards.

Technical Specifications

Voltage Level Translators MC10H351FNR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.2 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10H351FNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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