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MC10H350FN

Onsemi

MC10H350FN by Onsemi

MC10H350FN by Onsemi is a voltage level translator with 4 functions, operating at 5V. It features PECL to TTL translation, 5ns max delay, and TRUE output polarity. Ideal for commercial applications requiring ECL technology in a square chip carrier package.

Median Price

$4.159

Lifecycle Status

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31

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1k+

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Avnet

USA . 41 parts In-Stock

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Digiode

USA . 1,943 parts In-Stock

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TEDSS.com

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American Microsemiconductor Inc.

USA . 1,282 parts In-Stock

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Freelance Electronics

USA . 27 parts In-Stock

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Q Components

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Prism Electronics

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Elcom Components

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ComSIT Distribution GmbH

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Mentor Electronics Marketing, LLC

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Electronics Depot

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Atlantic Semiconductor

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Electronic Expediters

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Semi Source

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Speed Components Ltd

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Standard Data Resources

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ABC Electronics Ltd.

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Inland Empire Components Inc.

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Sogenti Electronics

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Corphita

USA . 1,094 parts In-Stock

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Corohmni

South Africa . 354 parts In-Stock

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Kepictronics

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Kulean Microsystems

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TANS Electronics

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Perfect Parts

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SupplyDigital Components

Austria . 1,289 parts In-Stock

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A-Plus Industry Inc.

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Speed Components Ltd (Excess)

Israel . 645 parts In-Stock

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GreenTree Electronics

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Microchip USA

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Türkiye . 86 parts In-Stock

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Overview

Discover the innovative MC10H350FN by Onsemi, a top-tier manufacturer known for delivering high-quality voltage level translators. This cutting-edge product offers customers unmatched performance and reliability, making it ideal for a wide range of applications. Experience seamless voltage translation with this advanced technology that provides exceptional value and benefits. Upgrade your projects with the MC10H350FN and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and space in the design.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for versatility in different power supply configurations, ensuring compatibility with a wide range of systems.

No. of Functions: 4

Having multiple functions in one device offers cost-effectiveness and space-saving benefits in circuit design.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it easy to integrate into tight spaces on the PCB.

Power Supplies (V): 5

Operates at a standard 5V power supply, making it compatible with many existing systems and reducing the need for additional power conversion components.

No. of Terminals: 20

Having a higher number of terminals allows for more connectivity options and versatility in circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal performance and reliability, making it suitable for high-frequency and high-power applications.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures compatibility with lower voltage systems, providing flexibility in system integration.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature range allows the device to operate reliably in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for the control of the output signal, providing flexibility in signal routing and integration with other components.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the device can operate in a wide range of temperature environments, making it suitable for various applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and reliability in the assembly process, ensuring a strong and durable connection.

Terminal Position: QUAD

The quad terminal position allows for easy connectivity and integration into the PCB layout, simplifying the design process.

Maximum Seated Height: 4.57 mm

The low maximum seated height saves space on the PCB and allows for a more compact overall design.

Width: 8.965 mm

The narrow width of the product enables efficient use of space on the PCB and allows for tighter packing of components.

Output Polarity: TRUE

Having true output polarity ensures accurate signal transmission and compatibility with other components in the system.

Peak Reflow Temperature °C: 235

The high peak reflow temperature tolerance allows for reliable soldering during the assembly process, ensuring a strong and durable connection.

Length: 8.965 mm

The compact length of the product saves space on the PCB, making it suitable for compact and space-constrained designs.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures the device can operate reliably in a wide range of temperature environments, making it suitable for various commercial applications.

Technology: ECL

The ECL technology offers high-speed performance and low power consumption, making it ideal for applications requiring fast signal transmission and efficiency.

Terminal Form: J BEND

The J bend terminal form offers easy soldering and reliability in the assembly process, ensuring a strong and durable connection.

Nominal Supply Voltage: 5 V

Operates at a standard 5V power supply, making it compatible with many existing systems and reducing the need for additional power conversion components.

Maximum Delay: 5 ns

The low maximum delay ensures fast signal transmission, making the product suitable for high-speed applications requiring quick response times.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy integration into the PCB layout and simplifies the assembly process.

Interface IC Type: PECL TO TTL TRANSLATOR

The PECL to TTL translator interface IC type enables the translation of signals between different logic levels, providing compatibility between PECL and TTL systems.

Technical Specifications

Voltage Level Translators MC10H350FN attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

5 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10H350FN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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