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MC10ELT24MNR4

Onsemi

MC10ELT24MNR4 by Onsemi

MC10ELT24MNR4 by Onsemi is a voltage level translator with 8 terminals, operating at -40 to 85 °C. It features TTL to ECL translation, 2 ns delay, and supports supply voltages of 5V and -5V. Ideal for industrial applications requiring precise signal conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,331 parts In-Stock

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Vyrian

USA . 1,146 parts In-Stock

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SupplyDigital Components

Austria . 4,592 parts In-Stock

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Kulean Microsystems

USA . 4,573 parts In-Stock

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TANS Electronics

Latvia . 2,293 parts In-Stock

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Problanco Electronics

Mexico . 1,885 parts In-Stock

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Corphita

USA . 1,003 parts In-Stock

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UHIMA Technologies

Türkiye . 502 parts In-Stock

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Corohmni

South Africa . 174 parts In-Stock

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Overview

Elevate your voltage level translation needs with the MC10ELT24MNR4 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. The MC10ELT24MNR4 is a surface mount voltage level translator designed to provide seamless communication between different voltage domains. With its compact size and wide operating temperature range, this device is perfect for industrial applications where precision and efficiency are key. Experience the value and benefits of smooth signal translation with the MC10ELT24MNR4 from Onsemi.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and convenient installation onto a PCB, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of systems and applications.

Package Shape: SQUARE

The square package shape makes the product easy to handle and integrate into the circuit design.

Power Supplies (V): 5,-4.5/-5.2

The dual power supply options allow for versatile compatibility with different voltage requirements.

No. of Terminals: 8

With 8 terminals, this voltage level translator offers flexibility in connections and signal routing.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style provides efficient heat dissipation and space-saving design for compact electronic devices.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures reliable operation even in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in extreme cold environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and reliability in the assembly process.

Terminal Position: DUAL

The dual terminal position offers flexibility in component orientation and connection options.

Maximum Seated Height: 1 mm

The low profile design with maximum seated height of 1 mm is ideal for compact and slim electronic devices.

Width: 2 mm

The small width of 2 mm allows for space-efficient PCB layout and integration in tight spaces.

Output Polarity: COMPLEMENTARY

The complementary output polarity enhances noise immunity and signal integrity in data transmission.

Length: 2 mm

The compact length of 2 mm contributes to the overall small form factor of the product and facilitates space-saving PCB design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions typically found in industrial settings.

Technology: ECL

The ECL technology offers high-speed operation and low power consumption, making it suitable for high-performance applications.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and contributes to lead-free manufacturing processes.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V ensures compatibility with standard voltage levels used in many electronic systems.

Nominal Negative Supply Voltage: -5 V

The nominal negative supply voltage of -5 V allows for dual power supply operation and compatibility with various signal levels.

Maximum Delay: 2 ns

The low maximum delay of 2 ns ensures minimal propagation delay for fast signal processing and data transmission.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density PCB designs and precise signal routing in compact layouts.

Interface IC Type: TTL TO ECL TRANSLATOR

This interface IC type facilitates seamless translation between TTL logic levels and ECL logic levels, enhancing compatibility and signal integrity.

Technical Specifications

Voltage Level Translators MC10ELT24MNR4 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2 ns

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

2 mm

Nominal Negative Supply Voltage:

-5 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5,-4.5/-5.2

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC10ELT24MNR4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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