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MC10H125MR1

Onsemi

MC10H125MR1 by Onsemi

MC10H125MR1 by Onsemi is a voltage level translator with 4 functions, operating b/w 0-75 °C. It has a supply voltage range of 4.75-5.25 V and offers ECL to TTL translation, making it ideal for commercial extended temperature grade applications. The package style is small outline with gull wing terminals, suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,100 parts In-Stock

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2,100

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Vyrian

USA . 1,638 parts In-Stock

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Electronics Depot

USA . 772 parts In-Stock

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772

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Problanco Electronics

Mexico . 8,251 parts In-Stock

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Kulean Microsystems

USA . 6,628 parts In-Stock

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6,628

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TANS Electronics

Latvia . 4,612 parts In-Stock

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Corphita

USA . 991 parts In-Stock

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SupplyDigital Components

Austria . 660 parts In-Stock

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660

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UHIMA Technologies

Türkiye . 527 parts In-Stock

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Corohmni

South Africa . 189 parts In-Stock

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Overview

Unlock new possibilities with the MC10H125MR1 by Onsemi, a top-of-the-line voltage level translator that delivers flawless performance and reliability. This product boasts advanced technology and superior craftsmanship from Onsemi, providing customers with a seamless experience in various applications. With its small outline package and true output polarity, this voltage translator guarantees efficient operation and precise results. Say goodbye to compatibility issues and hello to seamless communication with the MC10H125MR1. Elevate your projects with this innovative solution from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness.

Surface Mount: YES

Allows for easy installation on PCBs, saving assembly time and space.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage levels, providing flexibility in power supply options.

No. of Functions: 4

This product can perform multiple functions, making it versatile for various applications.

Package Shape: RECTANGULAR

This shape allows for efficient use of space on the PCB.

No. of Terminals: 16

Provides multiple connection points for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on the PCB and allows for dense PCB layouts.

Minimum Supply Voltage: 4.75 V

Works with lower voltage levels, providing compatibility with a wide range of systems.

Maximum Operating Temperature: 75 °C

Can operate effectively in high-temperature environments.

Minimum Operating Temperature: 0 °C

Can operate effectively in low-temperature environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Allows for flexibility in PCB layout and connection configurations.

Maximum Seated Height: 2.05 mm

Low profile design saves space and allows for compact PCB designs.

Width: 5.275 mm

Compact width allows for efficient use of space on the PCB.

Output Polarity: TRUE

Provides consistent output polarity for predictable signal behavior.

Length: 10.2 mm

Compact length contributes to space-saving PCB layouts.

Temperature Grade: COMMERCIAL EXTENDED

Suitable for a wide range of temperature conditions in commercial applications.

Technology: ECL

Utilizes ECL technology for high-speed and low-power operation.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder connections for secure PCB mounting.

Nominal Supply Voltage: 5 V

Compatible with standard 5V power sources.

Nominal Negative Supply Voltage: -5.2 V

Supports negative supply voltages for bidirectional signal translation.

Maximum Delay: 3.35 ns

Provides fast signal translation to minimize latency in the system.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts.

Interface IC Type: ECL TO TTL TRANSLATOR

Specifically designed for translating signals between ECL and TTL logic levels.

Technical Specifications

Voltage Level Translators MC10H125MR1 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.35 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H125MR1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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