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MC100H605FNR2

Onsemi

MC100H605FNR2 by Onsemi

MC100H605FNR2 by Onsemi is a 6-function ECL to TTL translator with 28 terminals. It operates b/w -4.5V to 5.25V, has a delay of 6.7ns, and supports true output polarity. Ideal for voltage level translation in electronic circuits requiring fast signal conversion at temperatures ranging from 0 °C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,457 parts In-Stock

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Digiode

USA . 993 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 431 parts In-Stock

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TANS Electronics

Latvia . 7,027 parts In-Stock

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Kulean Microsystems

USA . 6,327 parts In-Stock

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Problanco Electronics

Mexico . 2,818 parts In-Stock

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Corphita

USA . 1,071 parts In-Stock

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Microchip USA

USA . 284 parts In-Stock

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UHIMA Technologies

Türkiye . 227 parts In-Stock

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Corohmni

South Africa . 108 parts In-Stock

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SupplyDigital Components

Austria . 68 parts In-Stock

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Overview

Unleash the power of seamless voltage level translation with the MC100H605FNR2 by Onsemi. Designed with precision and reliability in mind, this innovative product offers unmatched quality and performance. Ideal for a variety of applications, this voltage level translator is the perfect solution for customers looking to enhance their systems with cutting-edge technology. Trust Onsemi's expertise and experience in manufacturing top-of-the-line components, and elevate your projects to new heights. Experience the value, benefits, and advantages that the MC100H605FNR2 brings to the table today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.25 V

Supports a wide range of input voltages, providing flexibility in various voltage level translation applications.

No. of Functions: 6

Having multiple functions in a single device reduces the need for additional components and simplifies the design.

Package Shape: SQUARE

Square shape design is compact and allows for efficient use of PCB real estate.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in a wide range of temperature environments.

Technology: ECL

ECL technology offers high-speed performance, making this voltage translator suitable for applications requiring fast signal processing.

Technical Specifications

Voltage Level Translators MC100H605FNR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

6.7 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-4.5 V

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Latch/Register:

REGISTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H605FNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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