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MC100ELT25DR2G

Onsemi

MC100ELT25DR2G by Onsemi

MC100ELT25DR2G by Onsemi is a voltage level translator with 8 terminals and ECL technology. It operates b/w -40 to 85 °C, translating ECL to TTL signals with a delay of 4.1 ns. Ideal for industrial applications requiring precise signal translation in compact spaces.

Median Price

$1.590

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 45,833 parts In-Stock

1+ parts

-

100+ parts

$1.470

1k+ parts

$1.320

10k+ parts

$1.240

45,833

-

$1.470

$1.320

$1.240

Verical

USA . 42,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.738

10k+ parts

-

42,285

-

-

$1.738

-

DigiKey

USA . 5,987 parts In-Stock

1+ parts

-

100+ parts

-

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$1.710

10k+ parts

$1.710

5,987

-

-

$1.710

$1.710

Farnell

UK . 5,987 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$1.420

5,987

-

-

-

$1.420

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 958 parts In-Stock

1+ parts

$1.558

100+ parts

-

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958

$1.558

-

-

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Vyrian

USA . 900 parts In-Stock

1+ parts

$1.640

100+ parts

-

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900

$1.640

-

-

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Flip Electronics

USA . 40,000 parts In-Stock

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40,000

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Chip Stock

USA . 9,500 parts In-Stock

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9,500

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Martec Srl

Italy . 16 parts In-Stock

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16

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 24,901 parts In-Stock

1+ parts

$1.390

100+ parts

-

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24,901

$1.390

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Corphita

USA . 1,292 parts In-Stock

1+ parts

$1.476

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1,292

$1.476

-

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Corohmni

South Africa . 121 parts In-Stock

1+ parts

$1.640

100+ parts

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121

$1.640

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TANS Electronics

Latvia . 5,933 parts In-Stock

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5,933

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Kulean Microsystems

USA . 5,527 parts In-Stock

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5,527

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Continental Prestige Electronics

USA . 3,772 parts In-Stock

1+ parts

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$1.420

10k+ parts

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3,772

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$1.420

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SupplyDigital Components

Austria . 1,468 parts In-Stock

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1,468

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Problanco Electronics

Mexico . 1,094 parts In-Stock

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Microchip USA

USA . 380 parts In-Stock

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380

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UHIMA Technologies

Türkiye . 212 parts In-Stock

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212

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Perfect Parts

USA . 18 parts In-Stock

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18

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Overview

Unlock new possibilities with the MC100ELT25DR2G voltage level translator from Onsemi. With a reputation for quality and reliability, Onsemi delivers cutting-edge technology in a compact package. This versatile voltage level translator is perfect for a wide range of applications, offering seamless communication between different voltage domains. Say goodbye to compatibility issues and experience smooth operation with the MC100ELT25DR2G. Trust Onsemi to provide top-notch performance and value for all your voltage level translation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the voltage level translator, ensuring a long lifespan.

Maximum Supply Voltage: 5.5 V

Suitable for applications requiring high voltage levels, making it versatile and compatible with a wide range of systems.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, making it reliable in various environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish on terminals allows for better solderability and conductivity, ensuring a secure connection.

Width: 3.9 mm

Compact size and small footprint make it suitable for applications where space is limited.

Nominal Supply Voltage: 5 V

Designed to operate at a standard 5V supply voltage, making it compatible with many existing systems.

Technical Specifications

Voltage Level Translators MC100ELT25DR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

4.1 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100ELT25DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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