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MC100EPT20MNR4

Onsemi

MC100EPT20MNR4 by Onsemi

MC100EPT20MNR4 by Onsemi is a voltage level translator with 3.3V supply, 0.45ns delay, and ECL technology. It has a small outline package suitable for industrial applications like translating TTL/CMOS to PECL signals in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,147 parts In-Stock

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Digiode

USA . 1,070 parts In-Stock

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1,070

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SupplyDigital Components

Austria . 7,847 parts In-Stock

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Kulean Microsystems

USA . 7,782 parts In-Stock

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Problanco Electronics

Mexico . 6,815 parts In-Stock

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TANS Electronics

Latvia . 4,783 parts In-Stock

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Corphita

USA . 2,477 parts In-Stock

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UHIMA Technologies

Türkiye . 554 parts In-Stock

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Corohmni

South Africa . 209 parts In-Stock

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Overview

Unlock the power of seamless voltage level translation with the MC100EPT20MNR4 by Onsemi. Designed with precision and reliability in mind, this voltage translator offers unparalleled performance for a wide range of applications. From industrial automation to telecommunications, this innovative product ensures smooth signal transmission while maintaining optimal efficiency. Say goodbye to compatibility issues and hello to seamless integration with the MC100EPT20MNR4. Experience the difference that quality engineering can make in your projects today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on a circuit board, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Supports a wide range of input voltages, making it versatile for different applications.

Package Shape: SQUARE

Provides a compact and uniform form factor, making it easy to integrate into existing designs.

Power Supplies (V): 3.3

Operates at a common voltage level, ensuring compatibility with standard power sources.

No. of Terminals: 8

Offers multiple connection points for versatile input and output options.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

Enhances thermal management, reduces profile height, and optimizes board space usage.

Minimum Supply Voltage: 3 V

Provides a reliable operating range with a margin for voltage fluctuations.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Maintains functionality in extreme cold temperatures, suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Enables strong solder connections for secure and durable terminal connections.

Terminal Position: DUAL

Supports bidirectional signal translation, allowing for flexible communication between different voltage levels.

Maximum Seated Height: 1 mm

Offers a low profile design for space-constrained applications.

Width: 2 mm

Compact size allows for easy placement on a circuit board while conserving space.

Output Polarity: COMPLEMENTARY

Provides complementary signals for balanced and reliable data transmission.

Peak Reflow Temperature °C: 235

Withstands high-temperature soldering processes during assembly without sacrificing performance.

Length: 2 mm

Compact length facilitates integration into tight spaces and small electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where temperature fluctuations and harsh conditions are expected.

Technology: ECL

Utilizes Emitter-Coupled Logic for high-speed and efficient signal translation.

Terminal Form: NO LEAD

Eliminates the risk of lead contamination and provides a environmentally-friendly terminal option.

Nominal Supply Voltage: 3.3 V

Matches common voltage levels used in digital circuits, ensuring compatibility with standard components.

Maximum Delay: 0.45 ns

Offers fast signal translation with minimal delay, ideal for high-speed data transmission.

Terminal Pitch: 0.5 mm

Provides a fine pitch for precise and secure connections on a circuit board.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

Facilitates seamless communication between different logic families, expanding the compatibility of the product.

Technical Specifications

Voltage Level Translators MC100EPT20MNR4 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.45 ns

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

2 mm

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC100EPT20MNR4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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