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MC100EPT21DT

Onsemi

MC100EPT21DT by Onsemi

MC100EPT21DT by Onsemi is a PECL to TTL translator with 8 terminals. It operates b/w -40 to 85 °C, with supply voltage of 3-3.6 V. With a max delay of 2.25 ns, it's ideal for industrial applications requiring precise voltage level translation.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,851 parts In-Stock

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Digiode

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Prism Electronics

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Classic Components Corporation

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Connector Distribution Corp

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Right Parts Inc.

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Zilex Electronics Inc.

Canada . 10 parts In-Stock

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Speed Components Ltd

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SupplyDigital Components

Austria . 5,813 parts In-Stock

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TANS Electronics

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Problanco Electronics

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Kulean Microsystems

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Authorized Procurement Solutions

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Corphita

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UHIMA Technologies

Türkiye . 622 parts In-Stock

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Perfect Parts

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Corohmni

South Africa . 77 parts In-Stock

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GreenTree Electronics

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Speed Components Ltd (Excess)

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Fairview Electronics Ltd

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Overview

Unlock the potential of your electronic designs with the MC100EPT21DT by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. The MC100EPT21DT is a voltage level translator that offers seamless integration and superior performance. Ideal for a wide range of applications, this product ensures precision and efficiency in your projects. Elevate your designs with the value and benefits that the MC100EPT21DT brings, providing you with the competitive edge you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various industrial applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in use with different systems without risk of overloading.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of devices and systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can function reliably in harsh industrial environments.

Minimum Operating Temperature: -40 °C

The product can operate in extremely cold temperatures, making it suitable for use in a variety of climates.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish ensures good conductivity and reliability in electrical connections.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with commonly used power supplies, simplifying integration.

Maximum Delay: 2.25 ns

The low maximum delay ensures fast and efficient signal translation, minimizing latency in the system.

Technical Specifications

Voltage Level Translators MC100EPT21DT attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.25 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MC100EPT21DT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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