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MC10H125FNR2G

Onsemi

MC10H125FNR2G by Onsemi

ECL TO TTL TRANSLATOR; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;

Median Price

$5.891

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 11 parts In-Stock

1+ parts

$5.412

100+ parts

$4.617

1k+ parts

$4.617

10k+ parts

$4.617

11

$5.412

$4.617

$4.617

$4.617

Rochester

USA . 1,825 parts In-Stock

1+ parts

$6.370

100+ parts

$6.240

1k+ parts

$6.120

10k+ parts

-

1,825

$6.370

$6.240

$6.120

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Avnet

USA . 500 parts In-Stock

1+ parts

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500

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Master Electronics

USA . 490 parts In-Stock

1+ parts

-

100+ parts

$7.640

1k+ parts

$7.060

10k+ parts

$6.790

490

-

$7.640

$7.060

$6.790

Chip1Stop

Japan . 490 parts In-Stock

1+ parts

-

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-

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490

-

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-

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Verical

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$4.617

1k+ parts

$4.617

10k+ parts

$4.617

11

-

$4.617

$4.617

$4.617

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,028 parts In-Stock

1+ parts

$5.016

100+ parts

-

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-

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1,028

$5.016

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-

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Vyrian

USA . 6,150 parts In-Stock

1+ parts

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6,150

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Rapid Electronics

USA . 490 parts In-Stock

1+ parts

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490

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Chip Stock

USA . 460 parts In-Stock

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460

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Bristol Electronics

USA . 403 parts In-Stock

1+ parts

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403

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Sea View Technologies

USA . 193 parts In-Stock

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193

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Sensible Micro Corp

USA . 111 parts In-Stock

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111

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Nova Conductors

Japan . 96 parts In-Stock

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96

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Inventory MP

USA . 83 parts In-Stock

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83

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 276 parts In-Stock

1+ parts

$3.920

100+ parts

-

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276

$3.920

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Corohmni

South Africa . 114 parts In-Stock

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$4.617

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114

$4.617

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Corphita

USA . 312 parts In-Stock

1+ parts

$4.752

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312

$4.752

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AZTECH Wire

Italy . 748 parts In-Stock

1+ parts

$8.980

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748

$8.980

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$13.328

100+ parts

$12.128

1k+ parts

$10.929

10k+ parts

-

20

$13.328

$12.128

$10.929

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Problanco Electronics

Mexico . 8,042 parts In-Stock

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8,042

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TANS Electronics

Latvia . 4,344 parts In-Stock

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4,344

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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SupplyDigital Components

Austria . 1,705 parts In-Stock

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1,705

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Kulean Microsystems

USA . 798 parts In-Stock

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798

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Legend Electronics Inc. (Excess)

USA . 549 parts In-Stock

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549

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Speed Components Ltd (Excess)

Israel . 549 parts In-Stock

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549

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Perfect Parts

USA . 470 parts In-Stock

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470

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Microchip USA

USA . 294 parts In-Stock

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294

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Netroflash

USA . 100 parts In-Stock

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100

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UHIMA Technologies

Türkiye . 68 parts In-Stock

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68

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Technical Specifications

Voltage Level Translators MC10H125FNR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.35 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10H125FNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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