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MC100H600FNG

Onsemi

MC100H600FNG by Onsemi

MC100H600FNG by Onsemi is a voltage level translator with 9 functions, operating at 4.5-5.5V supply range. It has a max delay of 3.2ns and converts TTL to ECL signals efficiently. Ideal for commercial extended temperature grade applications requiring precise signal translation in compact chip carrier package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,905 parts In-Stock

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Digiode

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QIE Inc.

USA . 125 parts In-Stock

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Prism Electronics

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AZTECH Wire

Italy . 101 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,149 parts In-Stock

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Microchip USA

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SupplyDigital Components

Austria . 4,602 parts In-Stock

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Kulean Microsystems

USA . 3,185 parts In-Stock

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Problanco Electronics

Mexico . 2,081 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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TANS Electronics

Latvia . 771 parts In-Stock

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UHIMA Technologies

Türkiye . 570 parts In-Stock

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Corphita

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Corohmni

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Overview

Experience seamless voltage level translation with the MC100H600FNG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. This voltage level translator is perfect for a wide range of applications, offering customers unmatched value and benefits. Say goodbye to compatibility issues and hello to smooth operation with the MC100H600FNG. Trust Onsemi for all your voltage level translation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic body provides durability and protection for the internal components, making the product long-lasting and reliable.

Maximum Supply Voltage: 5.5 V

Supports a wide range of input voltages, making it versatile and compatible with various systems.

No. of Functions: 9

Provides multiple functions in a single device, reducing the need for additional components and simplifying the design process.

Maximum Operating Temperature: 75 °C

Can operate efficiently in high-temperature environments, ensuring reliable performance under challenging conditions.

Maximum Delay: 3.2 ns

Offers fast signal processing with minimal delay, making it suitable for applications requiring quick response times.

Technical Specifications

Voltage Level Translators MC100H600FNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.2 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

9

No. of Terminals:

28

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-4.5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL100K

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

11.505 mm

Trade Compliance

MC100H600FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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