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MC100H602FNR2G

Onsemi

MC100H602FNR2G by Onsemi

MC100H602FNR2G by Onsemi is a voltage translator with 28 terminals, operating at -4.5V to 5.5V. It has a max delay of 3.2ns and operates in temperatures from 0 °C to 75°C. Ideal for TTL to ECL translation applications due to its ECL100K technology and J Bend terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,127 parts In-Stock

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Vyrian

USA . 1,296 parts In-Stock

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Problanco Electronics

Mexico . 7,573 parts In-Stock

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TANS Electronics

Latvia . 6,961 parts In-Stock

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SupplyDigital Components

Austria . 5,654 parts In-Stock

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Kulean Microsystems

USA . 3,155 parts In-Stock

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Corphita

USA . 777 parts In-Stock

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UHIMA Technologies

Türkiye . 486 parts In-Stock

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Corohmni

South Africa . 444 parts In-Stock

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Microchip USA

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Overview

Elevate your voltage level translation needs with the MC100H602FNR2G by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge solutions for a wide range of applications. This voltage level translator offers seamless communication between TTL and ECL interfaces, ensuring smooth operation and optimal performance. With its compact chip carrier package and wide operating temperature range, this product provides unmatched value and versatility. Upgrade your designs today with the MC100H602FNR2G and experience the benefits of precision engineering at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 5.5 V

Can handle a high supply voltage, making it compatible with a wide range of systems and applications.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board, especially when multiple components are being used.

Power Supplies (V): 5,-4.5

Supports dual power supplies, providing flexibility in power management and compatibility with various systems.

No. of Terminals: 28

Offers multiple connection points for interfacing with other components, enabling complex circuit designs and functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier style allows for efficient heat dissipation and provides a compact form factor for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Can function at a low supply voltage, optimizing power efficiency and performance in energy-sensitive applications.

Maximum Operating Temperature: 75 °C

Can operate under high temperatures without compromising performance, ensuring reliability in challenging environments.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, the product can function in a wide range of temperature conditions, increasing its versatility.

Terminal Finish: TIN

The TIN finish provides corrosion resistance and good electrical conductivity, enhancing the overall reliability and longevity of the product.

Terminal Position: QUAD

The quad terminal position allows for easy connection and compatibility with standard socket configurations, simplifying installation and maintenance.

Maximum Seated Height: 4.57 mm

With a low seated height, the product can be used in compact spaces while maintaining proper airflow and thermal management.

Width: 11.505 mm

The compact width enables efficient use of space on the circuit board, especially in applications where space is limited.

Output Polarity: TRUE

Having true output polarity ensures accurate signal translation and compatibility with other components, reducing errors and improving system performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering during the manufacturing process, ensuring strong and durable connections.

Length: 11.505 mm

The length of the product is optimized for compatibility with standard circuit board layouts, facilitating easy integration into existing systems.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures reliable operation in a wide temperature range, making it suitable for various commercial applications.

Technology: ECL100K

The ECL100K technology offers high-speed signal processing capabilities, making it ideal for applications requiring fast data transmission and low latency.

Terminal Form: J BEND

The J bend terminal form provides secure and reliable connections, reducing the risk of signal loss or interference in the transmission.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V ensures compatibility with standard power sources, simplifying integration into existing systems.

Maximum Delay: 3.2 ns

With a low maximum delay, the product enables fast signal translation and transmission, minimizing latency and improving system responsiveness.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact and efficient layout on the circuit board, reducing the overall footprint of the product.

Interface IC Type: TTL TO ECL TRANSLATOR

The interface IC type enables seamless communication between TTL and ECL devices, bridging the gap between different signal standards for enhanced compatibility.

Technical Specifications

Voltage Level Translators MC100H602FNR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.2 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-4.5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL100K

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H602FNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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