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MC10H124L

Onsemi

MC10H124L by Onsemi

MC10H124L by Onsemi is a TTL to ECL translator with 4 functions, operating at 5V and -5.2V. It has a max delay of 3.1ns, suitable for voltage level translation in commercial applications requiring fast signal conversion. With a compact rectangular package style and through-hole terminal form, it offers efficient integration into electronic circuits.

Median Price

$36.370

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

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Master Electronics

USA . 123 parts In-Stock

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$36.370

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$6.890

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Freelance Electronics

USA . 25 parts In-Stock

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$6.654

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$6.987

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$6.588

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$6.654

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Bristol Electronics

USA . 9 parts In-Stock

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$8.400

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American Microsemiconductor Inc.

USA . 40 parts In-Stock

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Digiode

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Vyrian

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ACDS - Activité Composants Distribution Service

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Velocity Electronics

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Mil-Aero Solutions, Inc.

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LWI Electronics Inc

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Corel Iberica Componentes, S.L.

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Cyclops Electronics Ltd

UK . 28 parts In-Stock

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North Shore Components

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NAC Semi

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Electro Mavin

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GES GmbH

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Prism Electronics

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Contempo Components LLC

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Elcom Components

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LittleDiode

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Corohmni

South Africa . 470 parts In-Stock

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Corphita

USA . 1,012 parts In-Stock

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Kulean Microsystems

USA . 3,331 parts In-Stock

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SupplyDigital Components

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TANS Electronics

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UHIMA Technologies

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Problanco Electronics

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Microchip USA

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Speed Components Ltd (Excess)

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Overview

Unlock the full potential of your electronic designs with the MC10H124L voltage level translator by Onsemi. Crafted with precision and expertise, this versatile device offers seamless integration and reliable performance in a wide range of applications. Elevate your projects with ease and efficiency, thanks to its innovative design and robust construction. Experience the difference with Onsemi's commitment to quality and excellence, and take your creations to new heights with the MC10H124L.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This ensures that the product is durable and can withstand harsh environmental conditions, making it a reliable choice.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for versatile applications and compatibility with a wide range of devices.

No. of Functions: 4

Having multiple functions in one product increases efficiency and saves space, making it a cost-effective option.

Minimum Operating Temperature: 0 °C

The wide operating temperature range ensures the product can function effectively in various environments, enhancing its usability.

Maximum Delay: 3.1 ns

The low maximum delay ensures fast response times, making it suitable for high-speed applications.

Technical Specifications

Voltage Level Translators MC10H124L attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.1 ns

Interface IC Type:

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.49 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10H124L Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-347-5530, 5962013475530

NIIN

013475530

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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