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SN65LVP20DRFRG4

Texas Instruments

SN65LVP20DRFRG4 by Texas Instruments

SN65LVP20DRFRG4 by Texas Instruments is a voltage level translator with 2.5/3.3V power supplies, PECL to LVDS interface, and 0.63ns max delay. It is used in industrial applications for translating signals b/w different voltage levels efficiently and accurately.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,917 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,917

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Vyrian

USA . 2,909 parts In-Stock

1+ parts

-

100+ parts

-

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-

2,909

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 453 parts In-Stock

1+ parts

$2.679

100+ parts

-

1k+ parts

$3.162

10k+ parts

-

453

$2.679

-

$3.162

-

DigiPath Technology Company

USA . 1,005 parts In-Stock

1+ parts

$2.950

100+ parts

$2.714

1k+ parts

-

10k+ parts

-

1,005

$2.950

$2.714

-

-

ChromeModa Solutions

Germany . 4,254 parts In-Stock

1+ parts

$3.010

100+ parts

$2.468

1k+ parts

-

10k+ parts

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4,254

$3.010

$2.468

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-

IDEA Electronic Components Group

UK . 720 parts In-Stock

1+ parts

$3.010

100+ parts

-

1k+ parts

$2.709

10k+ parts

-

720

$3.010

-

$2.709

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AZTECH Wire

Italy . 746 parts In-Stock

1+ parts

$10.881

100+ parts

-

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746

$10.881

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One Stop Electronics

USA . 603 parts In-Stock

1+ parts

$40.500

100+ parts

-

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603

$40.500

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Corphita

USA . 1,497 parts In-Stock

1+ parts

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1,497

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Overview

Unlock seamless voltage level translation with the SN65LVP20DRFRG4 by Texas Instruments. Crafted with precision and expertise, this small outline, heat sink package offers a wide operating temperature range, dual terminal position, and top-grade nickel palladium gold finish. Ideal for industrial applications, this voltage translator ensures reliable performance, enhanced efficiency, and simplified integration. Elevate your projects with the unparalleled quality and unmatched value of Texas Instruments' SN65LVP20DRFRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the voltage level translator, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage of 3.6V, this voltage level translator can handle higher voltage levels, making it versatile and compatible with a wide range of applications.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage of 2.375V allows the voltage level translator to operate effectively even at lower voltage levels, ensuring compatibility with different power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the voltage level translator can operate efficiently even in elevated temperature conditions, making it reliable for industrial use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the voltage level translator to function effectively in cold environments, making it suitable for a wide range of temperature conditions.

Maximum Delay: 0.63 ns

With a low maximum delay of 0.63ns, this voltage level translator ensures fast and efficient signal translations, making it ideal for applications requiring quick response times.

Technical Specifications

Voltage Level Translators SN65LVP20DRFRG4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

.63 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

SN65LVP20DRFRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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