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MC100EPT26DT

Onsemi

MC100EPT26DT by Onsemi

MC100EPT26DT by Onsemi is a voltage level translator with 3.3V supply, operating from -40 to 85 °C. It features PECL to TTL translation, TOTEM-POLE output, and 2.2ns delay. Ideal for industrial applications requiring precise signal conversion in compact form factor.

Median Price

$2.775

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22,694 parts In-Stock

1+ parts

-

100+ parts

$2.480

1k+ parts

$2.220

10k+ parts

$2.090

22,694

-

$2.480

$2.220

$2.090

DigiKey

USA . 22,694 parts In-Stock

1+ parts

-

100+ parts

$3.260

1k+ parts

-

10k+ parts

-

22,694

-

$3.260

-

-

Verical

USA . 15,710 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.775

10k+ parts

$2.612

15,710

-

-

$2.775

$2.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 23 parts In-Stock

1+ parts

$2.274

100+ parts

$2.387

1k+ parts

$2.251

10k+ parts

-

23

$2.274

$2.387

$2.251

-

Digiode

USA . 352 parts In-Stock

1+ parts

$2.632

100+ parts

-

1k+ parts

-

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352

$2.632

-

-

-

Vyrian

USA . 522 parts In-Stock

1+ parts

$2.770

100+ parts

-

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-

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-

522

$2.770

-

-

-

Semi Source

USA . 67 parts In-Stock

1+ parts

-

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-

1k+ parts

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67

-

-

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Mil-Aero Solutions, Inc.

USA . 43 parts In-Stock

1+ parts

-

100+ parts

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43

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-

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Lighthouse Electronics, Inc.

USA . 30 parts In-Stock

1+ parts

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30

-

-

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EMSNET

USA . 27 parts In-Stock

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27

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Prism Electronics

USA . 19 parts In-Stock

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LWI Electronics Inc

India . 18 parts In-Stock

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 316 parts In-Stock

1+ parts

$2.274

100+ parts

-

1k+ parts

-

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316

$2.274

-

-

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Corphita

USA . 1,972 parts In-Stock

1+ parts

$2.493

100+ parts

-

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10k+ parts

-

1,972

$2.493

-

-

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Continental Prestige Electronics

USA . 22,694 parts In-Stock

1+ parts

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100+ parts

$2.460

1k+ parts

-

10k+ parts

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22,694

-

$2.460

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RC Electronics

USA . 8,963 parts In-Stock

1+ parts

-

100+ parts

$6.850

1k+ parts

$6.460

10k+ parts

$6.320

8,963

-

$6.850

$6.460

$6.320

Kulean Microsystems

USA . 7,063 parts In-Stock

1+ parts

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7,063

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TANS Electronics

Latvia . 6,509 parts In-Stock

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6,509

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Problanco Electronics

Mexico . 3,823 parts In-Stock

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3,823

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SupplyDigital Components

Austria . 3,608 parts In-Stock

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3,608

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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UHIMA Technologies

Türkiye . 627 parts In-Stock

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627

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Perfect Parts

USA . 21 parts In-Stock

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21

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Assy Fe

Spain . 7 parts In-Stock

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7

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Overview

Elevate your electronic designs with the MC100EPT26DT voltage level translator by Onsemi. Crafted with precision and quality, this innovative product offers seamless translation between PECL and TTL signals, opening up a world of possibilities in communication systems, networking equipment, and industrial applications. With a compact design and reliable performance, this voltage level translator delivers unparalleled value and efficiency to customers seeking seamless signal conversion. Trust Onsemi for cutting-edge technology that propels your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in power requirements.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

Power Supplies (V): 3.3

Operates at a standard power supply voltage of 3.3V, compatible with many systems.

No. of Terminals: 8

Sufficient number of terminals for connectivity to other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and space-saving package style for efficient design layouts.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages, suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Output Characteristics: TOTEM-POLE

Provides strong signal output and can drive both high and low loads.

Minimum Operating Temperature: -40 °C

Can operate in very cold temperatures, suitable for outdoor applications.

Terminal Finish: TIN LEAD

Provides good electrical conductivity and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit board layout.

Maximum Seated Height: 1.1 mm

Low profile design for compact and slim devices.

Width: 3 mm

Narrow width for space-saving design layouts.

Output Polarity: TRUE

Consistent output polarity for easy interfacing with other components.

Peak Reflow Temperature °C: 235

Can withstand high reflow temperatures during manufacturing processes.

Length: 3 mm

Compact length for space-efficient circuit board designs.

Temperature Grade: INDUSTRIAL

Suitable for harsh industrial environments with wide temperature ranges.

Technology: ECL

Uses Emitter-Coupled Logic technology for high-speed and low-power operation.

Terminal Form: GULL WING

Gull wing terminal form for easy surface mounting and soldering.

Nominal Supply Voltage: 3.3 V

Standard 3.3V supply voltage for compatibility with various systems.

Maximum Delay: 2.2 ns

Low delay time for fast signal transmission in high-speed applications.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact and dense circuit board layouts.

Technical Specifications

Voltage Level Translators MC100EPT26DT attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.2 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MC100EPT26DT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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