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NVT2004TL

NXP Semiconductors

NVT2004TL by NXP Semiconductors

NVT2004TL by NXP Semiconductors is a 4-bit voltage level translator with a max supply voltage of 5.5V and operates b/w -40 °C to 85 °C. Its compact design features a dual terminal position and no lead form, ideal for space-constrained applications. This device efficiently interfaces GTL to TTL signals in industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,290 parts In-Stock

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Vyrian

USA . 3,634 parts In-Stock

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Anansix

USA . 1,448 parts In-Stock

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One Stop Electronics

USA . 481 parts In-Stock

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$28.500

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UNI Independent Distributors

Spain . 5,851 parts In-Stock

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Corphita

USA . 1,777 parts In-Stock

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Overview

Unlock seamless communication between low-voltage and high-voltage systems with the NVT2004TL from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers this compact voltage level translator, engineered for reliability in demanding applications. Experience enhanced design flexibility, minimized power consumption, and robust performance across diverse sectors, ensuring your projects stay ahead in efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that provides reliable protection for internal components, ensuring longevity and robustness in demanding applications.

Surface Mount: YES

Facilitates compact and efficient PCB designs, enabling high-density assembly and improving overall device performance.

Maximum Supply Voltage: 3.6 V

Versatile voltage range makes it suitable for various low-power applications, ensuring compatibility with multiple systems.

Package Shape: RECTANGULAR

Optimized shape for space-efficient layouts, allowing for easy integration into different circuit designs.

No. of Bits: 4

Supports 4-bit data transfer, offering a balance between performance and complexity for moderate data handling requirements.

Maximum Supply Voltage-1: 5.5 V

Provides flexibility for higher voltage systems, allowing this translator to bridge a wide range of voltage levels.

No. of Terminals: 12

Adequate terminal count for multifaceted application needs, enabling multiple connections without compromising layout space.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Minimized size and heat dissipation features are ideal for compact systems, enhancing thermal management in tight spaces.

Minimum Supply Voltage-1: 1.8 V

Ensures compatibility with lower voltage digital circuits, making it adaptable for modern low-power devices.

Minimum Supply Voltage: 1 V

Allows operation in ultra-low voltage environments, perfect for energy-sensitive applications.

Maximum Operating Temperature: 85 °C

High temperature tolerance makes it reliable for industrial applications where heat exposure is a concern.

Output Characteristics: OPEN-EMITTER

This feature allows for greater flexibility in interfacing with various logic families, enhancing compatibility.

Minimum Operating Temperature: -40 °C

Designed to function effectively in extreme cold conditions, this makes it suitable for outdoor and harsh environments.

Terminal Position: DUAL

Dual positioning aids in efficient routing on PCBs, providing improved design versatility.

Maximum Seated Height: 0.5 mm

Low profile design helps in applications where space is critical, aiding reduced overall unit height.

Width: 1.35 mm

Compact width allows for high-density integration in designs, contributing to the miniaturization of electronic products.

Output Polarity: TRUE

True output polarity ensures proper signal integrity and compatibility across digital circuits, enhancing reliability.

Length: 2.5 mm

Compact length suitable for tight spaces in electronic circuits, ensuring easy placement and routing options.

Temperature Grade: INDUSTRIAL

Rated for harsh industrial environments, guaranteeing performance in challenging conditions with high reliability.

Terminal Form: NO LEAD

Lead-free design is compliant with RoHS guidelines, making it an environmentally-friendly choice.

Terminal Pitch: 0.4 mm

Fine pitch is ideal for dense component placement, enabling the design of smaller and more efficient boards.

Interface IC Type: GTL TO TTL TRANSCEIVER

Designed to convert Logic Level signals, this IC supports seamless integration between different logic families.

Technical Specifications

Voltage Level Translators NVT2004TL attributes and parameters. Explore more Voltage Level Translators devices from NXP Semiconductors

Specs

Additional Features:

TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE

Interface IC Type:

JESD-30 Code:

R-PDSO-N12

Length:

2.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1.35 mm

Trade Compliance

NVT2004TL Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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