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MC10H605FNR2

Onsemi

MC10H605FNR2 by Onsemi

MC10H605FNR2 by Onsemi is a Voltage Level Translator with 6 functions, operating at -5.2V to 5.5V. It has a max delay of 6.7ns and interfaces as an ECL to TTL translator, suitable for high-speed signal conversion applications.

Median Price

$7.120

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,822 parts In-Stock

1+ parts

-

100+ parts

$6.160

1k+ parts

$5.510

10k+ parts

$5.180

1,822

-

$6.160

$5.510

$5.180

DigiKey

USA . 1,822 parts In-Stock

1+ parts

-

100+ parts

$7.120

1k+ parts

-

10k+ parts

-

1,822

-

$7.120

-

-

Verical

USA . 1,822 parts In-Stock

1+ parts

-

100+ parts

$7.700

1k+ parts

$6.888

10k+ parts

-

1,822

-

$7.700

$6.888

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,234 parts In-Stock

1+ parts

$6.010

100+ parts

-

1k+ parts

-

10k+ parts

-

2,234

$6.010

-

-

-

Digiode

USA . 1,359 parts In-Stock

1+ parts

$6.508

100+ parts

-

1k+ parts

-

10k+ parts

-

1,359

$6.508

-

-

-

MRC Electronics

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 426 parts In-Stock

1+ parts

$6.010

100+ parts

-

1k+ parts

-

10k+ parts

-

426

$6.010

-

-

-

Corphita

USA . 2,123 parts In-Stock

1+ parts

$6.165

100+ parts

-

1k+ parts

-

10k+ parts

-

2,123

$6.165

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 19,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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19,062

-

-

-

-

Problanco Electronics

Mexico . 8,033 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,033

-

-

-

-

Kulean Microsystems

USA . 7,758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,758

-

-

-

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SupplyDigital Components

Austria . 6,171 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,171

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-

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Microchip USA

USA . 5,254 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,254

-

-

-

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

-

-

-

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Continental Prestige Electronics

USA . 1,822 parts In-Stock

1+ parts

-

100+ parts

$6.060

1k+ parts

-

10k+ parts

-

1,822

-

$6.060

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,100

-

-

-

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Perfect Parts

USA . 1,081 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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1,081

-

-

-

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UHIMA Technologies

Türkiye . 872 parts In-Stock

1+ parts

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100+ parts

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872

-

-

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TANS Electronics

Latvia . 718 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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718

-

-

-

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Authorized Procurement Solutions

USA . 165 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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165

-

-

-

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GreenTree Electronics

Israel . 165 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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165

-

-

-

-

Overview

Unlock the power of seamless voltage translation with the MC10H605FNR2 by Onsemi. Crafted with precision and expertise, this innovative solution offers unparalleled quality and reliability. Ideal for a wide range of applications, this voltage level translator ensures smooth and efficient operation. Experience the value of enhanced performance and seamless communication with the MC10H605FNR2. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with this exceptional product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, ensuring the product's longevity.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of devices and circuits that require different voltage levels.

No. of Functions: 6

Offers versatility and capability to handle multiple functions efficiently.

Minimum Supply Voltage: 4.5 V

Provides flexibility in terms of power supply options and supports lower voltage applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Output Polarity: TRUE

Guarantees correct output polarity, preventing errors and ensuring accurate signal translation.

Technology: ECL

Utilizes Emitter-Coupled Logic technology which offers high-speed operation and reliable performance.

Technical Specifications

Voltage Level Translators MC10H605FNR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

6.7 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Latch/Register:

REGISTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H605FNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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