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FXLA104UMX

Onsemi

FXLA104UMX by Onsemi

FXLA104UMX by Onsemi is a 4-bit voltage level translator with 3-STATE output. It operates b/w -40 to 85 °C, supporting supply voltages of 1.1 to 3.6 V. Ideal for industrial applications requiring TTL/CMOS to CMOS translation in a compact chip carrier package.

Median Price

$0.330

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 179 parts In-Stock

1+ parts

$0.331

100+ parts

$0.214

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179

$0.331

$0.214

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Mouser Electronics

USA . 3,319 parts In-Stock

1+ parts

$0.480

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$0.267

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$0.240

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$0.219

3,319

$0.480

$0.267

$0.240

$0.219

Chip1Stop

Japan . 4,918 parts In-Stock

1+ parts

$0.591

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4,918

$0.591

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Rochester

USA . 404,583 parts In-Stock

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$0.266

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$0.221

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$0.197

404,583

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$0.266

$0.221

$0.197

DigiKey

USA . 402,183 parts In-Stock

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$0.330

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Verical

USA . 256,563 parts In-Stock

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256,563

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Flip Electronics (Authorized)

USA . 36,904 parts In-Stock

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Vyrian

USA . 1,259 parts In-Stock

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$0.201

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$0.201

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Digiode

USA . 709 parts In-Stock

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$0.207

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709

$0.207

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DigiKey Marketplace

USA . 405,823 parts In-Stock

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Flip Electronics

USA . 36,904 parts In-Stock

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Chip Stock

USA . 16,346 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 4,670 parts In-Stock

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Bristol Electronics

USA . 4,670 parts In-Stock

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4,670

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Cyclops Electronics Ltd

UK . 747 parts In-Stock

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Prism Electronics

USA . 154 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,818 parts In-Stock

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$0.196

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$0.196

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Corohmni

South Africa . 56 parts In-Stock

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$0.201

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56

$0.201

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Component Stockers USA

USA . 296,350 parts In-Stock

1+ parts

$0.570

100+ parts

$0.360

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$0.220

10k+ parts

$0.610

296,350

$0.570

$0.360

$0.220

$0.610

Microchip USA

USA . 2,266 parts In-Stock

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$1.495

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2,266

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Perfect Parts

USA . 61,496 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 20,550 parts In-Stock

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SupplyDigital Components

Austria . 6,577 parts In-Stock

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TANS Electronics

Latvia . 6,146 parts In-Stock

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Assy Fe

Spain . 6,026 parts In-Stock

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Problanco Electronics

Mexico . 4,895 parts In-Stock

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Lixinc

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GreenTree Electronics

Israel . 3,270 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,713 parts In-Stock

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Supply Digital

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Kulean Microsystems

USA . 1,224 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,142 parts In-Stock

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UHIMA Technologies

Türkiye . 597 parts In-Stock

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S.R.D Solutions

India . 260 parts In-Stock

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Northwest PG Solutions

USA . 240 parts In-Stock

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Native Components

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Kepictronics

USA . 68 parts In-Stock

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Overview

Experience seamless voltage level translation with the FXLA104UMX by Onsemi. Crafted with precision and reliability, this product guarantees top-notch performance in a variety of applications. Whether you're in need of voltage level translators for industrial automation, consumer electronics, or communication systems, this product offers unmatched value, benefits, and advantages to meet your needs. Trust in Onsemi's expertise and elevate your projects with the FXLA104UMX.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Can handle a wide range of supply voltages, making it versatile for various applications.

Package Shape: RECTANGULAR

Rectangular package shape is common and easy to handle during manufacturing and assembly processes.

No. of Bits: 4

4 bits provide sufficient capability for voltage level translation requirements in most scenarios.

Power Supplies (V): 1.2/3.3

Supports multiple power supply voltages, allowing compatibility with different systems.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and devices in a circuit.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier package style with a thin profile enhances space-saving and facilitates compact designs.

Minimum Supply Voltage: 1.1 V

Operates efficiently even at lower supply voltages, improving energy efficiency.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial environments.

Output Characteristics: 3-STATE

3-state output allows for flexibility in controlling the output signal, enhancing functionality.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, making it suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and reliability in signal transmission.

Terminal Position: QUAD

Quad terminal position facilitates secure connections and stability in the circuit.

Maximum Seated Height: 0.55 mm

Low seated height allows for compact and slim designs, ideal for space-constrained applications.

Width: 1.8 mm

Narrow width enables easy integration into densely populated circuit boards.

Output Polarity: TRUE

True output polarity ensures accurate signal translation and compatibility with the receiving end.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliability and durability during reflow soldering.

Length: 2.6 mm

Compact length contributes to overall space-saving benefits in circuit design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature resistance ensures stable performance in harsh operating conditions.

Terminal Form: NO LEAD

Lead-free terminal form aligns with environmental regulations and promotes sustainability.

Maximum Supply Current: 0.01 mA

Low supply current consumption minimizes power usage, contributing to energy efficiency.

Nominal Supply Voltage: 1.3 V

Stable nominal supply voltage for consistent performance in various operating conditions.

Maximum Delay: 7.9 ns

Low delay time ensures fast and efficient voltage level translation.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for precise connections and compact layout designs.

Interface IC Type: TTL/CMOS TO CMOS TRANSLATOR

Versatile interface IC type supporting various voltage translation requirements.

Technical Specifications

Voltage Level Translators FXLA104UMX attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

7.9 ns

Interface IC Type:

JESD-30 Code:

R-XQCC-N16

JESD-609 Code:

e4

Length:

2.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.07X.1,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.01 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.8 mm

Trade Compliance

FXLA104UMX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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