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FXLA101FHX

Onsemi

FXLA101FHX by Onsemi

The Onsemi FXLA101FHX is a voltage level translator with 1.2/3.3V power supplies, operating from -40 to 85 °C. It features TTL/CMOS to CMOS translation, no-lead terminals, and a small outline package shape. Ideal for industrial applications requiring precise signal conversion in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,666 parts In-Stock

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Vyrian

USA . 1,557 parts In-Stock

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Kulean Microsystems

USA . 7,539 parts In-Stock

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Supply Digital

USA . 2,426 parts In-Stock

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Corphita

USA . 1,840 parts In-Stock

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Northwest PG Solutions

USA . 1,610 parts In-Stock

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UHIMA Technologies

Türkiye . 874 parts In-Stock

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Native Components

USA . 813 parts In-Stock

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Problanco Electronics

Mexico . 804 parts In-Stock

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Corohmni

South Africa . 470 parts In-Stock

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TANS Electronics

Latvia . 404 parts In-Stock

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SupplyDigital Components

Austria . 206 parts In-Stock

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Overview

Unlock new possibilities with the FXLA101FHX by Onsemi, a voltage level translator that guarantees top-notch quality and reliability. Manufactured by industry leader Onsemi, this product is perfect for a wide range of applications. From consumer electronics to industrial automation, the FXLA101FHX offers seamless voltage translation with ease. Experience the value and benefits of this innovative product and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes this product easy to install on PCBs, saving space and making assembly more efficient.

Power Supplies (V): 1.2/3.3

This voltage range allows the product to work with a variety of power supplies, offering flexibility in different applications.

No. of Terminals: 6

Having 6 terminals allows for multiple connections to other components, enabling versatile and complex circuit designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environments and extended use without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can function in cold conditions, making it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit layout and ease of connection, making installation and maintenance simpler.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product is rugged and reliable, suitable for demanding environments.

Maximum Delay: 0 ns

Having zero delay ensures fast signal transmission, making this product ideal for high-speed communication systems.

Terminal Pitch: 0.35 mm

The small terminal pitch allows for compact designs and efficient use of space on PCBs, especially in applications with limited board real estate.

Interface IC Type: TTL/CMOS TO CMOS TRANSLATOR

This interface IC type enables seamless communication between different logic levels, ensuring compatibility and reliable data transmission in mixed-signal systems.

Technical Specifications

Voltage Level Translators FXLA101FHX attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

0 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-N6

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.2/3.3

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Trade Compliance

FXLA101FHX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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