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SN100KT5576NT

Texas Instruments

SN100KT5576NT by Texas Instruments

SN100KT5576NT by Texas Instruments is an ECL to TTL translator with 8 functions, operating b/w 0-85°C. It features a 3-state output, inverted polarity, and through-hole terminal form. Ideal for voltage level translation applications requiring a nominal voltage of 5V and -4.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,426 parts In-Stock

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Digiode

USA . 2,746 parts In-Stock

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2,746

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,695 parts In-Stock

1+ parts

$8.863

100+ parts

-

1k+ parts

$9.547

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1,695

$8.863

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$9.547

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DigiPath Technology Company

USA . 2,142 parts In-Stock

1+ parts

$9.759

100+ parts

$8.978

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2,142

$9.759

$8.978

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ChromeModa Solutions

Germany . 5,169 parts In-Stock

1+ parts

$9.958

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$8.166

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5,169

$9.958

$8.166

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IDEA Electronic Components Group

UK . 439 parts In-Stock

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$9.958

100+ parts

$9.460

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$8.962

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439

$9.958

$9.460

$8.962

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AZTECH Wire

Italy . 302 parts In-Stock

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$14.357

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302

$14.357

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One Stop Electronics

USA . 679 parts In-Stock

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$30.500

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679

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Corphita

USA . 2,167 parts In-Stock

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Overview

Unlock new possibilities with the SN100KT5576NT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality voltage level translators that offer exceptional performance and reliability. This versatile product is perfect for a wide range of applications, providing seamless communication between different voltage levels. Experience the value and benefits of this innovative solution, designed to enhance your projects and streamline your workflow. Discover the advantages of choosing Texas Instruments for all your voltage translation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the voltage level translator.

No. of Functions: 8

This product offers a high number of functions, making it versatile and capable of handling multiple voltage translation tasks simultaneously.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic circuits and systems.

No. of Terminals: 24

With a high number of terminals, this voltage level translator can connect to multiple devices and components for efficient voltage translation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output characteristics provide flexibility in controlling the output signals of the translator.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable operation in a wide range of temperature conditions.

Terminal Position: DUAL

The dual terminal position offers flexibility in connecting the translator to different types of circuits and systems.

Maximum Seated Height: 5.08 mm

The compact maximum seated height enables easy integration of the translator into space-constrained electronic devices.

Width: 7.62 mm

The narrow width of the translator makes it suitable for applications where space is limited.

Output Polarity: INVERTED

The inverted output polarity allows for compatibility with a wide range of electronic devices and systems.

Length: 31.64 mm

The moderate length of the translator provides a balance between compactness and connectivity in electronic circuits.

Technology: BIPOLAR

The bipolar technology used in this translator ensures high-speed and reliable voltage translation performance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers easy and secure connections to circuit boards and other electronic components.

Input Characteristics: STANDARD

The standard input characteristics ensure compatibility with a wide range of input signals and voltage levels.

Output Latch/Register: REGISTER

The use of registers in the output circuitry allows for stable and latched output signals, improving overall system reliability.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage makes this translator compatible with a wide range of electronic devices and systems.

Nominal Negative Supply Voltage: -4.5 V

The -4.5V nominal negative supply voltage ensures that the translator can handle a variety of signal levels for accurate voltage translation.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch offers compatibility with standard electronic components and circuit boards.

Interface IC Type: ECL TO TTL TRANSLATOR

The specific interface IC type of ECL to TTL translator indicates the compatibility and functionality of the translator in translating between these two specific technologies.

Technical Specifications

Voltage Level Translators SN100KT5576NT attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDIP-T24

Length:

31.64 mm

Nominal Negative Supply Voltage:

-4.5 V

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

REGISTER

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN100KT5576NT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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