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MC100H607FNR2

Onsemi

MC100H607FNR2 by Onsemi

MC100H607FNR2 by Onsemi is a voltage level translator with 6 functions, operating b/w 0-85 °C. It has PECL to TTL interface, 8.3ns delay, and supports supply voltages of 4.75-5.25V. Ideal for applications requiring true output polarity in compact chip carrier package style.

Median Price

$7.800

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 420 parts In-Stock

1+ parts

$7.800

100+ parts

$4.680

1k+ parts

$4.485

10k+ parts

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420

$7.800

$4.680

$4.485

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Vyrian

USA . 2,280 parts In-Stock

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2,280

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Digiode

USA . 57 parts In-Stock

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57

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Distributors (Availability)

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QUARKTWIN TECHNOLOGY LTD

USA . 11,475 parts In-Stock

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11,475

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TANS Electronics

Latvia . 5,765 parts In-Stock

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5,765

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SupplyDigital Components

Austria . 5,421 parts In-Stock

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5,421

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Microchip USA

USA . 5,196 parts In-Stock

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Corphita

USA . 2,075 parts In-Stock

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2,075

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Kulean Microsystems

USA . 863 parts In-Stock

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863

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Problanco Electronics

Mexico . 848 parts In-Stock

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848

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Corohmni

South Africa . 440 parts In-Stock

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440

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UHIMA Technologies

Türkiye . 280 parts In-Stock

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280

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Overview

Enhance your electronic designs with the MC100H607FNR2 by Onsemi - a top-quality Voltage Level Translator that delivers reliable performance and seamless integration. With Onsemi's renowned reputation for excellence in semiconductor manufacturing, this innovative product offers unparalleled precision and efficiency in a wide range of applications. Elevate your projects with the superior value, flexibility, and cutting-edge technology that the MC100H607FNR2 provides, setting you apart from the competition with its high performance and reliability. Trust Onsemi for all your voltage translation needs and experience the difference in quality and performance today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology enables easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this voltage level translator can handle a wide range of input voltages, ensuring compatibility with different systems.

No. of Functions: 6

The multiple functions provided by this voltage level translator offer versatility and flexibility in voltage translation requirements.

Package Shape: SQUARE

The square package shape allows for easier integration and placement on the circuit board, optimizing space utilization.

Power Supplies (V): 5

Operating at a nominal supply voltage of 5V, this voltage level translator is compatible with standard power sources in many electronic devices.

No. of Terminals: 28

The abundance of terminals provides ample connection points for interfacing with various components, enhancing versatility in circuit design.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact form factor that is ideal for devices with limited space, making this voltage level translator suitable for small-scale applications.

Minimum Supply Voltage: 4.75 V

With a low minimum supply voltage, this voltage level translator can operate efficiently even with lower power sources, ensuring compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance allows the voltage level translator to function reliably in various environments, including those with elevated temperatures.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the voltage level translator can operate effectively even in colder conditions, maximizing its usability.

Terminal Finish: TIN LEAD

The tin lead finish on the terminals promotes good solderability, facilitating secure and reliable connections during assembly.

Terminal Position: QUAD

The quad terminal configuration offers improved stability and support for the connection points, enhancing the overall durability and reliability of the voltage level translator.

Maximum Seated Height: 4.57 mm

The low maximum seated height allows for a slim profile, making this voltage level translator suitable for applications where space constraints are a concern.

Width: 11.505 mm

The moderate width of the device allows for easy integration into standard circuit board layouts, enabling seamless installation in various electronic systems.

Output Polarity: TRUE

The true output polarity ensures accurate signal conversion, providing seamless voltage translation between different logic levels without introducing errors.

Peak Reflow Temperature °C: 235

With a high peak reflow temperature, this voltage level translator can withstand the soldering process with ease, ensuring reliable assembly and robust connections.

Length: 11.505 mm

The compact length of the device contributes to its overall space-saving design, making it suitable for applications where size constraints are a consideration.

Technology: ECL

Employing ECL technology, this voltage level translator offers high-speed signal processing capabilities, making it ideal for applications that require rapid voltage conversion.

Terminal Form: J BEND

The J-bend terminal form facilitates easy and secure soldering during assembly, ensuring stable and reliable connections for optimal performance.

Output Latch/Register: REGISTER

The presence of output latch/register functionality allows for temporary storage of converted signals, improving signal integrity and reducing the risk of data loss during voltage translation.

Nominal Supply Voltage: 5 V

Operating at a standard 5V nominal supply voltage, this voltage level translator is compatible with a wide range of electronic devices and systems, simplifying integration.

Maximum Delay: 8.3 ns

With a low maximum delay, this voltage level translator ensures rapid signal conversion, minimizing latency and optimizing overall system performance.

Terminal Pitch: 1.27 mm

The fine terminal pitch allows for precise connection and alignment during assembly, ensuring secure and accurate interfacing with other components on the circuit board.

Interface IC Type: PECL TO TTL TRANSLATOR

The specific interface IC type simplifies the voltage translation process between PECL and TTL logic levels, making this voltage level translator a suitable choice for applications requiring this conversion.

Technical Specifications

Voltage Level Translators MC100H607FNR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

8.3 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Latch/Register:

REGISTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H607FNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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