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DP8481J

Texas Instruments

DP8481J by Texas Instruments

The Texas Instruments DP8481J is a 5-bit voltage level translator with TTL to ECL interface. It operates at temperatures from 0°C to 75°C, with power supplies of 5V and -5.2V. The package style is in-line, making it suitable for applications requiring inverted output polarity and open-emitter characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,935 parts In-Stock

1+ parts

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8,935

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Digiode

USA . 4,090 parts In-Stock

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4,090

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Anansix

USA . 2,018 parts In-Stock

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2,018

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Distributors (Availability)

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One Stop Electronics

USA . 1,016 parts In-Stock

1+ parts

$1.500

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1,016

$1.500

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AZTECH Wire

Italy . 629 parts In-Stock

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$5.220

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629

$5.220

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Parana Technologies

USA . 1,348 parts In-Stock

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$8.316

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$8.938

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1,348

$8.316

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$8.938

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DigiPath Technology Company

USA . 249 parts In-Stock

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$9.157

100+ parts

$8.425

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249

$9.157

$8.425

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ChromeModa Solutions

Germany . 4,174 parts In-Stock

1+ parts

$9.344

100+ parts

$7.662

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4,174

$9.344

$7.662

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IDEA Electronic Components Group

UK . 1,148 parts In-Stock

1+ parts

$9.344

100+ parts

$8.877

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$8.410

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1,148

$9.344

$8.877

$8.410

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Corphita

USA . 2,989 parts In-Stock

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2,989

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Northwest PG Solutions

USA . 1,254 parts In-Stock

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Native Components

USA . 291 parts In-Stock

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291

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Overview

Elevate your voltage level translation game with the DP8481J from Texas Instruments. Manufactured with top-quality materials and cutting-edge technology, this device is a game-changer in the world of voltage level translators. With a sleek rectangular package style and 16 terminals, this product offers unmatched performance and reliability. From TTL to ECL translation, the DP8481J ensures seamless communication across different voltage levels. Say goodbye to compatibility issues and hello to smooth operation with this innovative solution. Upgrade your system today and experience the difference with the DP8481J.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package ensures durability and protection for the internal components, making the product reliable in various environments.

No. of Bits: 5

With 5 bits of precision, this voltage level translator provides accurate and efficient signal conversion for your electronic devices.

Power Supplies (V): 5,-5.2

Supporting both positive and negative power supplies, this voltage level translator offers versatility in powering different types of circuits.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature of 75°C allows the product to withstand heat and operate reliably in demanding conditions.

Output Polarity: INVERTED

The inverted output polarity can be beneficial for certain applications where inversion of signals is required, providing flexibility in signal processing.

Technology: BIPOLAR

Utilizing bipolar technology, this voltage level translator ensures efficient signal conversion with low power consumption and high speed performance.

Technical Specifications

Voltage Level Translators DP8481J attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

0 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.43 mm

No. of Bits:

5

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

LATCH

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Level Translators

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

DP8481J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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