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DP8482AN

Texas Instruments

DP8482AN by Texas Instruments

The Texas Instruments DP8482AN is a voltage level translator with 5 functions, operating b/w -4.815V to 5.5V. It features ECL technology, 16 terminals in an in-line package style, and output polarity is inverted. Ideal for ECL to TTL translation applications due to its 15ns max delay and 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,947 parts In-Stock

1+ parts

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2,947

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Vyrian

USA . 2,143 parts In-Stock

1+ parts

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2,143

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Electronic Expediters

USA . 1,964 parts In-Stock

1+ parts

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1,964

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Anansix

USA . 1,161 parts In-Stock

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1,161

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 962 parts In-Stock

1+ parts

$4.748

100+ parts

-

1k+ parts

$5.251

10k+ parts

-

962

$4.748

-

$5.251

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DigiPath Technology Company

USA . 1,508 parts In-Stock

1+ parts

$5.228

100+ parts

$4.810

1k+ parts

-

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1,508

$5.228

$4.810

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ChromeModa Solutions

Germany . 5,143 parts In-Stock

1+ parts

$5.335

100+ parts

$4.375

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5,143

$5.335

$4.375

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IDEA Electronic Components Group

UK . 1,067 parts In-Stock

1+ parts

$5.335

100+ parts

-

1k+ parts

$4.802

10k+ parts

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1,067

$5.335

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$4.802

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Native Components

USA . 74 parts In-Stock

1+ parts

$7.481

100+ parts

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74

$7.481

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AZTECH Wire

Italy . 294 parts In-Stock

1+ parts

$17.579

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294

$17.579

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One Stop Electronics

USA . 1,382 parts In-Stock

1+ parts

$31.500

100+ parts

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1,382

$31.500

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Alle Elektronik GmbH

Germany . 4,200 parts In-Stock

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4,200

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Corphita

USA . 4,108 parts In-Stock

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4,108

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Northwest PG Solutions

USA . 406 parts In-Stock

1+ parts

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$7.331

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406

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$7.331

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Kepictronics

USA . 47 parts In-Stock

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47

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Overview

Experience seamless voltage level translation with the DP8482AN by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers top-quality products that exceed industry standards. The DP8482AN is a versatile voltage level translator with 5 functions, perfect for a wide range of applications. With its reliable performance and innovative design, this product offers unmatched value and benefits to customers looking for efficient voltage translation solutions. Trust Texas Instruments for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of devices.

No. of Functions: 5

With 5 functions integrated into one device, this product offers multiple voltage level translation capabilities in a single package.

Package Shape: RECTANGULAR

The rectangular shape of the package provides easy integration and mounting in various electronic circuits.

Maximum Supply Voltage-1: -4.815 V

The negative maximum supply voltage capability enables bi-directional voltage level translation, making the product versatile for different signal types.

No. of Terminals: 16

With 16 terminals, this product offers a high level of connectivity, allowing for multiple input and output options.

Package Style (Meter): IN-LINE

The in-line package style saves space and simplifies PCB layout, making it suitable for compact electronic designs.

Minimum Supply Voltage-1: -4.185 V

The low minimum supply voltage capability enables compatibility with a wide range of devices requiring different voltage levels.

Minimum Supply Voltage: 4.5 V

The high minimum supply voltage ensures stable operation under varying voltage conditions, improving overall reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to function reliably in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output allows for tristate logic implementation, enabling efficient signal transmission in electronic circuits.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can operate in a wide range of temperature environments, making it versatile for various applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and ensures a reliable electrical connection.

Terminal Position: DUAL

The dual terminal position offers flexibility in connecting the device to different parts of the circuit, improving versatility.

Maximum Seated Height: 5.08 mm

The low maximum seated height allows for compact design integration, ideal for space-constrained applications.

Width: 7.62 mm

The narrow width of the product facilitates space-saving installation on a PCB, optimizing layout efficiency.

Output Polarity: INVERTED

The inverted output polarity provides flexibility in signal processing, allowing for compatibility with various devices and systems.

Length: 21.755 mm

The moderate length of the product provides a good balance between functionality and space savings in electronic designs.

Technology: ECL

The ECL technology used in this product offers high-speed operation and low power consumption, making it suitable for high-performance applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering process and ensures secure connections, enhancing the product's reliability.

Output Latch/Register: LATCH

The latch output feature allows for temporary data storage, enabling efficient data processing and transmission in complex circuits.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard voltage levels used in many electronic systems, making it easy to integrate.

Maximum Delay: 15 ns

The low maximum delay time ensures fast signal transmission, ideal for high-speed communication applications.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm provides compatibility with common PCB layouts, simplifying the integration process.

Nominal Supply Voltage-1: -4.5 V

The negative nominal supply voltage capability allows for bidirectional voltage level translation, expanding the range of compatible devices.

Interface IC Type: ECL TO TTL TRANSLATOR

The interface IC type ECL to TTL translator bridges the gap between ECL and TTL logic levels, enabling seamless communication between devices using different voltage standards.

Technical Specifications

Voltage Level Translators DP8482AN attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

15 ns

Interface IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

21.755 mm

No. of Bits:

1

No. of Functions:

5

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

LATCH

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

-4.815 V

Minimum Supply Voltage-1:

-4.185 V

Nominal Supply Voltage-1:

-4.5 V

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

DP8482AN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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