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MC100H680FNG

Onsemi

MC100H680FNG by Onsemi

MC100H680FNG by Onsemi is a voltage level translator with 4 functions, operating b/w 0-75 °C. It features TTL to ECL transceiver interface, 4.8 ns max delay, and 5.5 V max supply voltage. Ideal for applications requiring high-speed signal translation in compact spaces.

Median Price

$26.660

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 14 parts In-Stock

1+ parts

$6.236

100+ parts

-

1k+ parts

-

10k+ parts

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14

$6.236

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Chip1Stop

Japan . 14 parts In-Stock

1+ parts

$26.400

100+ parts

-

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14

$26.400

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Rochester

USA . 3,455 parts In-Stock

1+ parts

-

100+ parts

$26.660

1k+ parts

$23.850

10k+ parts

$22.450

3,455

-

$26.660

$23.850

$22.450

DigiKey

USA . 3,455 parts In-Stock

1+ parts

-

100+ parts

$30.890

1k+ parts

$30.890

10k+ parts

$30.890

3,455

-

$30.890

$30.890

$30.890

Verical

USA . 2,576 parts In-Stock

1+ parts

-

100+ parts

$33.325

1k+ parts

$29.813

10k+ parts

$28.063

2,576

-

$33.325

$29.813

$28.063

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 440 parts In-Stock

1+ parts

$5.924

100+ parts

-

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440

$5.924

-

-

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Vyrian

USA . 2,118 parts In-Stock

1+ parts

$6.236

100+ parts

-

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2,118

$6.236

-

-

-

DigiKey Marketplace

USA . 3,455 parts In-Stock

1+ parts

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1k+ parts

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3,455

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Elcom Components

USA . 185 parts In-Stock

1+ parts

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185

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PC Components Company LLC

USA . 46 parts In-Stock

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46

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Bristol Electronics

USA . 46 parts In-Stock

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46

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$4.371

100+ parts

$3.978

1k+ parts

$3.584

10k+ parts

-

500

$4.371

$3.978

$3.584

-

Corphita

USA . 1,439 parts In-Stock

1+ parts

$5.612

100+ parts

-

1k+ parts

-

10k+ parts

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1,439

$5.612

-

-

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Corohmni

South Africa . 329 parts In-Stock

1+ parts

$6.236

100+ parts

-

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329

$6.236

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Kulean Microsystems

USA . 7,317 parts In-Stock

1+ parts

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7,317

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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-

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SupplyDigital Components

Austria . 4,668 parts In-Stock

1+ parts

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4,668

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QUARKTWIN TECHNOLOGY LTD

USA . 3,981 parts In-Stock

1+ parts

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3,981

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Problanco Electronics

Mexico . 3,771 parts In-Stock

1+ parts

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3,771

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UHIMA Technologies

Türkiye . 567 parts In-Stock

1+ parts

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567

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TANS Electronics

Latvia . 324 parts In-Stock

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324

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Microchip USA

USA . 251 parts In-Stock

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251

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Perfect Parts

USA . 41 parts In-Stock

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41

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Overview

Upgrade your voltage level translation with the MC100H680FNG by Onsemi. This high-quality chip carrier package offers 4 functions in a compact square shape, perfect for a wide range of applications. With a commercial extended temperature grade and 3-state output characteristics, this device provides reliable performance in diverse environments. Trust Onsemi's expertise in semiconductor manufacturing to deliver unmatched value and benefits to customers seeking seamless signal conversion. Experience faster, more efficient operations with the MC100H680FNG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the voltage level translator.

Surface Mount: YES

Allows for easy and convenient installation on a circuit board.

Maximum Supply Voltage: 5.5 V

Can handle high voltage levels, making it suitable for a variety of applications.

No. of Functions: 4

Offers multiple functions in a single component, saving space and reducing costs.

Package Shape: SQUARE

Provides a compact and uniform design for easy integration into circuit layouts.

No. of Terminals: 28

Offers multiple connection points for versatile interfacing with other components.

Package Style (Meter): CHIP CARRIER

Ensures efficient heat dissipation and compact form factor.

Minimum Supply Voltage: 4.5 V

Can operate at low voltage levels, providing flexibility in power supply requirements.

Maximum Operating Temperature: 75 °C

Can withstand high operating temperatures, making it suitable for industrial environments.

Output Characteristics: 3-STATE

Allows for tristate output, enabling efficient interfacing with multiple devices.

Minimum Operating Temperature: 0 °C

Can operate in low temperature conditions, suitable for a wide range of environments.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance for reliable performance.

Terminal Position: QUAD

Allows for organized and easy connections with other components on the circuit board.

Maximum Seated Height: 4.57 mm

Has a low profile design, saving space in compact electronic devices.

Width: 11.505 mm

Has a standard width dimension for compatibility with common PCB layouts.

Output Polarity: COMPLEMENTARY

Provides complementary output signals, enhancing signal integrity and reducing noise.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing processes.

Length: 11.505 mm

Has a standard length dimension for compatibility with common PCB layouts.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for fast and high-performance signal processing.

Terminal Form: J BEND

Features J-bend terminals for secure and reliable connections.

Nominal Supply Voltage: 5 V

Operates at a standard voltage level, compatible with common electronic systems.

Maximum Delay: 4.8 ns

Offers fast signal processing with minimal delay, crucial for high-speed applications.

Terminal Pitch: 1.27 mm

Provides a standard terminal pitch for easy integration into PCB layouts.

Moisture Sensitivity Level (MSL): 3

Has moderate moisture sensitivity, suitable for common soldering and storage conditions.

Interface IC Type: TTL TO ECL TRANSCEIVER

Acts as a translator between TTL and ECL signal levels, enabling seamless communication between different devices.

Technical Specifications

Voltage Level Translators MC100H680FNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

4.8 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

28

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H680FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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