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DP8481D

Texas Instruments

DP8481D by Texas Instruments

The Texas Instruments DP8481D is a voltage level translator with 16 terminals, operating at temperatures from 0 to 70°C. It features power supplies of 5V and -5.2V, suitable for TTL to ECL translation applications. This small outline package with gull wing terminals is surface mountable and ideal for commercial-grade projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,852 parts In-Stock

1+ parts

-

100+ parts

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6,852

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Digiode

USA . 4,899 parts In-Stock

1+ parts

-

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-

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4,899

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,511 parts In-Stock

1+ parts

$0.500

100+ parts

-

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-

10k+ parts

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1,511

$0.500

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-

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Parana Technologies

USA . 60 parts In-Stock

1+ parts

$8.419

100+ parts

-

1k+ parts

$9.057

10k+ parts

-

60

$8.419

-

$9.057

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DigiPath Technology Company

USA . 2,135 parts In-Stock

1+ parts

$9.271

100+ parts

$8.529

1k+ parts

-

10k+ parts

-

2,135

$9.271

$8.529

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ChromeModa Solutions

Germany . 3,491 parts In-Stock

1+ parts

$9.460

100+ parts

$7.757

1k+ parts

-

10k+ parts

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3,491

$9.460

$7.757

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IDEA Electronic Components Group

UK . 171 parts In-Stock

1+ parts

$9.460

100+ parts

$8.987

1k+ parts

$8.514

10k+ parts

-

171

$9.460

$8.987

$8.514

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AZTECH Wire

Italy . 464 parts In-Stock

1+ parts

$12.224

100+ parts

-

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464

$12.224

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Native Components

USA . 342 parts In-Stock

1+ parts

$254.140

100+ parts

$249.057

1k+ parts

$246.516

10k+ parts

$243.974

342

$254.140

$249.057

$246.516

$243.974

Northwest PG Solutions

USA . 1,608 parts In-Stock

1+ parts

$279.554

100+ parts

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1,608

$279.554

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Corphita

USA . 3,087 parts In-Stock

1+ parts

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3,087

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Overview

Unlock seamless voltage translation with the DP8481D by Texas Instruments, a game-changer in the world of Voltage Level Translators. Crafted with precision and expertise, this small outline package offers unparalleled performance and reliability. Whether you're looking to bridge TTL to ECL interfaces or enhance signal integrity, the DP8481D is your go-to solution. Experience the power of Texas Instruments and elevate your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to external factors, ensuring the longevity of the product.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular package shape is a common and efficient design that allows for easy handling and placement within electronic systems.

Power Supplies (V): 5,-5.2

Support for both 5V and -5.2V power supplies provides flexibility and compatibility with various voltage requirements in different applications.

No. of Terminals: 16

Having 16 terminals allows for multiple input and output connections, enabling the device to handle complex signal translations effectively.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions or during extended usage periods.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the device to function accurately even in cold environments, making it suitable for a wide range of applications.

Terminal Position: DUAL

Dual terminal position enables easy and secure connection of the device to external components, ensuring stable signal transmission.

Technology: ECL

The use of ECL technology enables high-speed signal translation with low power consumption, making the product efficient and reliable in various applications.

Interface IC Type: TTL TO ECL TRANSLATOR

The specific interface IC type allows for seamless translation between TTL and ECL signal levels, facilitating communication between different parts of a circuit.

Technical Specifications

Voltage Level Translators DP8481D attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Sub-Category:

Level Translators

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

DP8481D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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