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NVT2006BQ

NXP Semiconductors

NVT2006BQ by NXP Semiconductors

NVT2006BQ by NXP Semiconductors is a 6-bit voltage level translator with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. Its compact, no-lead design makes it ideal for space-constrained applications. Perfect for interfacing b/w different logic levels in industrial systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 4,719 parts In-Stock

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Vyrian

USA . 4,487 parts In-Stock

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Flip Electronics

USA . 2,918 parts In-Stock

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Anansix

USA . 385 parts In-Stock

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One Stop Electronics

USA . 706 parts In-Stock

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$48.500

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706

$48.500

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UNI Independent Distributors

Spain . 7,295 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,867 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Corphita

USA . 4,973 parts In-Stock

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Overview

Unlock seamless connectivity with the NVT2006BQ from NXP Semiconductors, a trusted leader in innovative solutions. This versatile voltage level translator ensures reliable communication across devices operating at different voltage levels, enhancing performance in various applications from industrial automation to IoT systems. With its robust design and wide operating temperature range, enjoy the peace of mind that comes with quality and reliability, elevating your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures a strong, reliable product suited for various applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact placement on PCBs, saving space.

Maximum Supply Voltage: 3.6 V

A moderate maximum supply voltage makes it compatible with a wide range of devices.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient layout and connectivity in circuit designs.

No. of Bits: 6

With 6 bits, it supports multiple signals, making it suitable for complex applications.

Maximum Supply Voltage-1: 5.5 V

This higher supply voltage offers flexibility for connecting to various voltage systems.

No. of Terminals: 16

The 16 terminals provide extensive connectivity options for various circuit configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This profile is ideal for heat dissipation and compact designs, enhancing performance.

Minimum Supply Voltage-1: 1.8 V

This lower voltage requirement enables operation in low-power applications.

Minimum Supply Voltage: 1 V

A minimum voltage of 1V allows for use in ultra-low power devices.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature rating ensures reliability in harsh environments.

Output Characteristics: OPEN-EMITTER

Open-emitter output character adds flexibility in interfacing with other components.

Minimum Operating Temperature: -40 °C

With a low temperature rating, this product is suitable for extreme environments.

Terminal Position: QUAD

Quad terminal positioning enhances circuit board design options and layout efficiency.

Maximum Seated Height: 1 mm

A low seated height allows for compact integration in space-constrained applications.

Width: 2.5 mm

Narrow width allows for dense packaging on PCBs, optimizing layout designs.

Output Polarity: TRUE

True output polarity simplifies interfacing and enhances compatibility with various circuits.

Length: 3.5 mm

A compact length supports space-saving designs, suitable for miniaturized devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures durability and reliability in demanding applications.

Terminal Form: NO LEAD

No-lead design minimizes space and enhances environmental compatibility.

Terminal Pitch: 0.5 mm

A tight terminal pitch enhances the ability to pack more components in smaller areas.

Interface IC Type: VOLTAGE LEVEL TRANSLATOR

Designed explicitly for voltage level translation, making it ideal for multi-voltage systems.

Technical Specifications

Voltage Level Translators NVT2006BQ attributes and parameters. Explore more Voltage Level Translators devices from NXP Semiconductors

Specs

Additional Features:

TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE

Interface IC Type:

JESD-30 Code:

R-PQCC-N16

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

2.5 mm

Trade Compliance

NVT2006BQ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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