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MC100EPT24MNR4

Onsemi

MC100EPT24MNR4 by Onsemi

MC100EPT24MNR4 by Onsemi is a voltage level translator with max supply voltage of 3.6V, operating from -40 to 85 °C. It features ECL technology, small outline package, and interfaces LVTTL/LVCMOS to LVECL. Ideal for industrial applications requiring fast signal translation in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,910 parts In-Stock

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Vyrian

USA . 1,861 parts In-Stock

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Problanco Electronics

Mexico . 6,221 parts In-Stock

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SupplyDigital Components

Austria . 4,107 parts In-Stock

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Kulean Microsystems

USA . 1,788 parts In-Stock

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Corphita

USA . 581 parts In-Stock

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TANS Electronics

Latvia . 493 parts In-Stock

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UHIMA Technologies

Türkiye . 163 parts In-Stock

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Corohmni

South Africa . 57 parts In-Stock

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Overview

Unlock new possibilities with the MC100EPT24MNR4 voltage level translator by Onsemi. Designed for industrial-grade applications, this surface-mount device offers unparalleled quality and reliability. With a wide operating temperature range and dual-terminal position, this translator seamlessly converts signals from LVTTL/LVCMOS to LVECL. Say goodbye to compatibility issues and experience seamless communication in your projects. Trust Onsemi's expertise and elevate your designs with the MC100EPT24MNR4 today.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy integration into a variety of electronic devices and circuits.

Maximum Supply Voltage: 3.6 V

Provides a wide range of compatibility with different power sources and components.

Package Shape: SQUARE

A compact and efficient shape that can easily fit into tight spaces within a circuit board.

Power Supplies (V): +-3.3

Allows for bidirectional voltage translation, making it versatile for use in both input and output signal conversion.

No. of Terminals: 8

Sufficient number of terminals for connecting to multiple input and output devices for translation.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and thin profile design make it suitable for compact and high-density electronic applications.

Minimum Supply Voltage: 3 V

Ensures reliable performance even at low voltage levels, enhancing the product's versatility.

Maximum Operating Temperature: 85 °C

Can operate effectively in a wide range of temperature environments, ensuring stability and reliability under varying conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, making it suitable for use in diverse environments.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity options and flexibility in circuit design.

Maximum Seated Height: 1 mm

Low profile design minimizes the space required for installation, ideal for compact electronic devices.

Width: 2 mm

Narrow width allows for efficient placement within a circuit layout, saving valuable space on the PCB.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures accurate and consistent signal translation, essential for reliable data transmission.

Length: 2 mm

Compact length facilitates easy integration into tight layouts and enhances overall space efficiency.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh operating conditions and industrial settings.

Technology: ECL

Employing ECL technology offers superior speed and performance, making it suitable for high-speed signal translation applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with modern environmental standards and regulations.

Nominal Supply Voltage: 3.3 V

Nominal voltage specification for compatibility with standard power sources and devices in the market.

Nominal Negative Supply Voltage: -3.3 V

Support for negative supply voltage enables bidirectional voltage translation with dual power supply operation.

Maximum Delay: 0.8 ns

Ultra-low delay ensures minimal signal latency, critical for high-speed data processing and transmission.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise and secure connections, enhancing the overall reliability of the device.

Interface IC Type: LVTTL/LVCMOS TO LVECL TRANSLATOR

Designed specifically for translating signals between different voltage levels, ensuring seamless interoperability between various electronic components.

Technical Specifications

Voltage Level Translators MC100EPT24MNR4 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.8 ns

JESD-30 Code:

S-XDSO-N8

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-3.3 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

+-3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC100EPT24MNR4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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