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MC100EPT20D

Onsemi

MC100EPT20D by Onsemi

TTL/CMOS TO PECL TRANSLATOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$2.513

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,510 parts In-Stock

1+ parts

-

100+ parts

$2.240

1k+ parts

$2.010

10k+ parts

$1.890

4,510

-

$2.240

$2.010

$1.890

DigiKey

USA . 4,510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.950

10k+ parts

-

4,510

-

-

$2.950

-

Verical

USA . 4,510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.513

10k+ parts

-

4,510

-

-

$2.513

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,398 parts In-Stock

1+ parts

$2.060

100+ parts

-

1k+ parts

-

10k+ parts

-

2,398

$2.060

-

-

-

Digiode

USA . 525 parts In-Stock

1+ parts

$2.375

100+ parts

-

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-

10k+ parts

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525

$2.375

-

-

-

Carlin Systems, Inc.

USA . 410 parts In-Stock

1+ parts

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-

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410

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-

-

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Semi Source

USA . 235 parts In-Stock

1+ parts

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235

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-

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Bristol Electronics

USA . 162 parts In-Stock

1+ parts

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162

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R&J Components

USA . 98 parts In-Stock

1+ parts

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98

-

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LIBRA Elektronik GmbH

Germany . 88 parts In-Stock

1+ parts

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100+ parts

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88

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Prism Electronics

USA . 30 parts In-Stock

1+ parts

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30

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Sea View Technologies

USA . 7 parts In-Stock

1+ parts

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7

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BCID Electronics Ltd.

Israel . 2 parts In-Stock

1+ parts

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2

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 270 parts In-Stock

1+ parts

$2.060

100+ parts

-

1k+ parts

-

10k+ parts

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270

$2.060

-

-

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Corphita

USA . 1,735 parts In-Stock

1+ parts

$2.250

100+ parts

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10k+ parts

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1,735

$2.250

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Continental Prestige Electronics

USA . 4,510 parts In-Stock

1+ parts

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100+ parts

$2.210

1k+ parts

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4,510

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$2.210

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SupplyDigital Components

Austria . 3,699 parts In-Stock

1+ parts

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3,699

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-

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TANS Electronics

Latvia . 3,542 parts In-Stock

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3,542

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Problanco Electronics

Mexico . 1,980 parts In-Stock

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1,980

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UHIMA Technologies

Türkiye . 908 parts In-Stock

1+ parts

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908

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Kulean Microsystems

USA . 184 parts In-Stock

1+ parts

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184

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Perfect Parts

USA . 34 parts In-Stock

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34

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Technical Specifications

Voltage Level Translators MC100EPT20D attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.45 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100EPT20D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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