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SN10KHT5542NTE4

Texas Instruments

SN10KHT5542NTE4 by Texas Instruments

SN10KHT5542NTE4 by Texas Instruments is a voltage level translator with 8 functions, operating at 5.5V max supply voltage and -5.2V negative supply. It features TTL to ECL translation, with a max delay of 3.7ns, making it ideal for high-speed signal conversion applications in commercial extended temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,837 parts In-Stock

1+ parts

-

100+ parts

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6,837

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Digiode

USA . 2,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,340

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 562 parts In-Stock

1+ parts

$8.371

100+ parts

-

1k+ parts

$9.000

10k+ parts

-

562

$8.371

-

$9.000

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DigiPath Technology Company

USA . 1,102 parts In-Stock

1+ parts

$9.218

100+ parts

-

1k+ parts

-

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1,102

$9.218

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ChromeModa Solutions

Germany . 4,664 parts In-Stock

1+ parts

$9.406

100+ parts

$7.713

1k+ parts

-

10k+ parts

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4,664

$9.406

$7.713

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IDEA Electronic Components Group

UK . 2,189 parts In-Stock

1+ parts

$9.406

100+ parts

$8.936

1k+ parts

$8.465

10k+ parts

-

2,189

$9.406

$8.936

$8.465

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One Stop Electronics

USA . 717 parts In-Stock

1+ parts

$13.500

100+ parts

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1k+ parts

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717

$13.500

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AZTECH Wire

Italy . 225 parts In-Stock

1+ parts

$14.498

100+ parts

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225

$14.498

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Corphita

USA . 2,143 parts In-Stock

1+ parts

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2,143

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Overview

Enhance your electronic designs with the SN10KHT5542NTE4 by Texas Instruments, a top-tier manufacturer known for producing high-quality components. This voltage level translator is perfect for a wide range of applications, offering precise and reliable performance. With its compact design and advanced technology, this product provides exceptional value, benefits, and advantages to customers looking to optimize their systems. Upgrade your projects with the SN10KHT5542NTE4 and experience superior quality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package of this product durable and resistant to external environmental factors.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V allows for compatibility with a wide range of voltage levels, making it versatile for different applications.

No. of Functions: 8

With 8 functions, this product can handle multiple tasks efficiently, making it a cost-effective solution for complex systems.

Package Shape: RECTANGULAR

The rectangular shape of the package provides easy integration into various circuit board layouts, optimizing space usage.

Power Supplies (V): 5,-5.2

Dual power supplies of 5V and -5.2V provide flexibility in powering the device, ensuring stable and reliable operation.

No. of Terminals: 24

With 24 terminals, this product offers a high degree of connectivity options, allowing for efficient signal routing and connections.

Package Style (Meter): IN-LINE

The in-line package style enhances ease of installation and maintenance, making it suitable for applications where space is limited.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5V ensures compatibility with a wide range of power sources, enhancing its versatility.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature of 75°C ensures reliable performance even in elevated temperature environments.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics offer flexibility in signal routing and connection options, enhancing the versatility of this product.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in cold temperature conditions, making it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in installation, ensuring secure connections and improving reliability.

Maximum Seated Height: 5.08 mm

The low maximum seated height of 5.08mm allows for compact design and efficient space utilization in electronic systems.

Width: 7.62 mm

The narrow width of 7.62mm ensures compatibility with standard spacing requirements and facilitates easy integration into existing circuit designs.

Output Polarity: INVERTED

Inverted output polarity offers flexibility in signal processing and compatibility with different interface requirements, enhancing the product's versatility.

Length: 31.64 mm

The moderate length of 31.64mm provides a balance between compact design and ease of handling during installation and maintenance.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable performance over a wide temperature range, making it suitable for industrial and commercial applications.

Technology: BIPOLAR

Bipolar technology offers high-speed signal processing capabilities, making this product suitable for applications requiring fast data transmission.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and reliable connections, ensuring stable operation in challenging environments.

Maximum Supply Current: 25 mA

The maximum supply current of 25mA ensures power efficiency and reliability in operation, making it suitable for low-power applications.

Input Characteristics: STANDARD

Standard input characteristics offer compatibility with a wide range of input signals, making this product versatile and widely applicable.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides stable power input for consistent performance in various applications.

Nominal Negative Supply Voltage: -5.2 V

The nominal negative supply voltage of -5.2V ensures proper biasing and signal processing, enhancing the product's performance.

Maximum Delay: 3.7 ns

The low maximum delay of 3.7ns ensures fast signal conversion and processing, making this product suitable for high-speed applications.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54mm provides compatibility with standard spacing requirements, facilitating easy installation and connection in various systems.

Interface IC Type: TTL TO ECL TRANSLATOR

The TTL to ECL translator interface IC type enables seamless communication between devices operating at different logic levels, enhancing compatibility and connectivity.

Technical Specifications

Voltage Level Translators SN10KHT5542NTE4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

3.7 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDIP-T24

Length:

31.64 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Level Translators

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN10KHT5542NTE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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