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MC10H125ML2

Onsemi

MC10H125ML2 by Onsemi

MC10H125ML2 by Onsemi is a voltage level translator with 4 functions, operating b/w 0-75 °C. It has a supply voltage range of 4.75-5.25 V and offers ECL technology for ECL to TTL translation applications. The package is small outline, surface mountable with dual terminals and Gull Wing finish.

Median Price

$6.720

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 1,265 parts In-Stock

1+ parts

$6.720

100+ parts

$2.912

1k+ parts

$2.755

10k+ parts

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1,265

$6.720

$2.912

$2.755

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Vyrian

USA . 2,438 parts In-Stock

1+ parts

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2,438

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Digiode

USA . 208 parts In-Stock

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208

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 8,329 parts In-Stock

1+ parts

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8,329

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TANS Electronics

Latvia . 7,766 parts In-Stock

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7,766

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Problanco Electronics

Mexico . 3,366 parts In-Stock

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3,366

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SupplyDigital Components

Austria . 3,216 parts In-Stock

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3,216

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Corphita

USA . 1,087 parts In-Stock

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1,087

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Corohmni

South Africa . 491 parts In-Stock

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491

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UHIMA Technologies

Türkiye . 30 parts In-Stock

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30

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Overview

Upgrade your voltage level translation needs with the MC10H125ML2 by Onsemi. With a reputation for producing high-quality electronic components, Onsemi delivers reliable solutions for a variety of applications. The MC10H125ML2 offers customers value and benefits such as seamless integration, efficient performance, and versatile usage. Trust in Onsemi's expertise and experience to meet your voltage level translation requirements with this top-of-the-line product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for the product, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle a wide range of input voltages, increasing its versatility.

No. of Functions: 4

Having 4 functions in one device simplifies circuit design and reduces the number of components needed, leading to cost savings and improved reliability.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the PCB and easy integration into existing designs.

No. of Terminals: 16

With 16 terminals, this product offers ample connectivity options, making it suitable for complex circuits and applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices and systems.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing the versatility of the product.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions, ensuring reliable performance in various applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature enables this product to function effectively in cold environments, expanding its range of potential applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit layout and makes it easier to connect the product in different configurations.

Output Polarity: TRUE

Having true output polarity ensures accurate signal conversion and compatibility with various digital systems, enhancing the product's functionality.

Temperature Grade: COMMERCIAL EXTENDED

Designed for commercial extended temperature range, this product can operate reliably in diverse environments, making it suitable for a wide range of applications.

Technology: ECL

Built on ECL technology, this product provides fast and efficient signal processing, ideal for high-speed applications requiring precise timing.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical stability and ease of soldering, ensuring robust connections and facilitating assembly.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5 V makes this product compatible with standard power sources, simplifying integration into existing systems.

Nominal Negative Supply Voltage: -5.2 V

The nominal negative supply voltage of -5.2 V allows for bidirectional signal translation, enabling seamless communication between systems with different voltage levels.

Maximum Delay: 3.4 ns

With a low maximum delay of 3.4 ns, this product ensures fast signal translation, critical for high-speed applications requiring minimal latency.

Interface IC Type: ECL TO TTL TRANSLATOR

As an ECL to TTL translator, this product facilitates seamless communication between logic families, enabling compatibility between different types of circuits and systems.

Technical Specifications

Voltage Level Translators MC10H125ML2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.4 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

MC10H125ML2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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