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10H524M/B2AJC

Onsemi

10H524M/B2AJC by Onsemi

10H524M/B2AJC by Onsemi is a voltage level translator with 16 terminals in a chip carrier package. It features TTL to ECL translation, suitable for interfacing different logic levels. Ideal for applications requiring surface mount technology and quad terminal positioning.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 215 parts In-Stock

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215

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Digiode

USA . 155 parts In-Stock

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155

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 95 parts In-Stock

1+ parts

$0.584

100+ parts

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95

$0.584

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Northwest PG Solutions

USA . 63 parts In-Stock

1+ parts

$0.642

100+ parts

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63

$0.642

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Kulean Microsystems

USA . 6,756 parts In-Stock

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6,756

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TANS Electronics

Latvia . 4,978 parts In-Stock

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4,978

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SupplyDigital Components

Austria . 3,546 parts In-Stock

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3,546

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Problanco Electronics

Mexico . 2,890 parts In-Stock

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2,890

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Corphita

USA . 1,297 parts In-Stock

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1,297

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UHIMA Technologies

Türkiye . 316 parts In-Stock

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316

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Corohmni

South Africa . 175 parts In-Stock

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175

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Overview

Elevate your voltage level translation needs with the 10H524M/B2AJC by Onsemi. This chip carrier package boasts 16 terminals and seamless surface mount integration, making it a top choice for TTL to ECL translation. Onsemi's reputation for quality shines through in this product, offering customers reliability and precision in their applications. Experience smooth signal transitions and enhanced performance with this versatile voltage level translator. Elevate your projects with Onsemi's 10H524M/B2AJC today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and secure installation on circuit boards, saving space and making the product more versatile for various applications.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting to different components in a circuit, allowing for a wider range of compatibility and functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact and durable housing for the product, protecting the internal components from external elements and ensuring reliable performance.

Terminal Position: QUAD

Quad terminal position enables easy and secure connection to other devices or components, reducing the risk of loose connections and signal interference.

Terminal Form: NO LEAD

No lead terminals are environmentally friendly and easier to handle during installation, reducing the risk of damage to the product or circuit board.

Interface IC Type: TTL TO ECL TRANSLATOR

The TTL to ECL translator interface IC type ensures seamless communication between devices operating at different voltage levels, making this product ideal for voltage level translation applications.

Technical Specifications

Voltage Level Translators 10H524M/B2AJC attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

X-XQCC-N16

No. of Terminals:

16

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

10H524M/B2AJC Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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