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DP8483J

Texas Instruments

DP8483J by Texas Instruments

The Texas Instruments DP8483J is a voltage level translator with 5 functions, operating b/w 4.5V to 5.5V. It features TTL to ECL translation, with inverted output polarity and open-emitter characteristics. Ideal for applications requiring fast response times and precise signal conversion in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,410 parts In-Stock

1+ parts

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4,410

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Vyrian

USA . 3,735 parts In-Stock

1+ parts

-

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3,735

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Anansix

USA . 493 parts In-Stock

1+ parts

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493

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 710 parts In-Stock

1+ parts

$1.624

100+ parts

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710

$1.624

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Northwest PG Solutions

USA . 459 parts In-Stock

1+ parts

$1.786

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459

$1.786

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Parana Technologies

USA . 430 parts In-Stock

1+ parts

$8.967

100+ parts

$832.699

1k+ parts

$8.070

10k+ parts

-

430

$8.967

$832.699

$8.070

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AZTECH Wire

Italy . 756 parts In-Stock

1+ parts

$9.846

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756

$9.846

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DigiPath Technology Company

USA . 2,003 parts In-Stock

1+ parts

$9.874

100+ parts

$9.084

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2,003

$9.874

$9.084

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IDEA Electronic Components Group

UK . 1,713 parts In-Stock

1+ parts

$10.075

100+ parts

$9.571

1k+ parts

$9.068

10k+ parts

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1,713

$10.075

$9.571

$9.068

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ChromeModa Solutions

Germany . 687 parts In-Stock

1+ parts

$10.075

100+ parts

$8.262

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687

$10.075

$8.262

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One Stop Electronics

USA . 325 parts In-Stock

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$26.500

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325

$26.500

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Corphita

USA . 3,815 parts In-Stock

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3,815

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Overview

Upgrade your voltage level translation needs with the Texas Instruments DP8483J. With a reputation for excellence and innovation, Texas Instruments delivers high-quality products that exceed industry standards. The DP8483J is perfect for a wide range of applications, offering seamless voltage level translation with its advanced technology and efficient design. Experience the value and benefits of this top-of-the-line product, designed to simplify your projects and provide reliable performance. Choose Texas Instruments for superior quality and unmatched performance in voltage level translators.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package provides durability and protection, making the product suitable for harsh environments.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this voltage level translator can safely handle high voltage inputs, providing reliable performance.

No. of Functions: 5

Having 5 functions in one package offers versatility and flexibility in voltage level translation applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures stable operation even in elevated temperature environments.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics allow for easy interfacing with other components, simplifying circuit design.

Technical Specifications

Voltage Level Translators DP8483J attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

7.5 ns

Interface IC Type:

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.43 mm

Nominal Negative Supply Voltage:

-4.5 V

No. of Bits:

1

No. of Functions:

5

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

LATCH

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

DP8483J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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