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MC100EPT22DG

Onsemi

MC100EPT22DG by Onsemi

MC100EPT22DG by Onsemi is a voltage level translator with 2 functions, operating at 3.3V. It has a max delay of 0.7ns and interfaces TTL/CMOS to PECL signals. Ideal for industrial applications requiring precise signal translation in compact designs.

Median Price

$7.262

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 13 parts In-Stock

1+ parts

$7.980

100+ parts

$5.970

1k+ parts

$5.710

10k+ parts

-

13

$7.980

$5.970

$5.710

-

Mouser Electronics

USA . 92 parts In-Stock

1+ parts

$12.110

100+ parts

$6.340

1k+ parts

$6.040

10k+ parts

$5.920

92

$12.110

$6.340

$6.040

$5.920

Flip Electronics (Authorized)

USA . 150,166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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150,166

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-

-

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Rochester

USA . 228 parts In-Stock

1+ parts

-

100+ parts

$5.660

1k+ parts

$5.070

10k+ parts

$4.770

228

-

$5.660

$5.070

$4.770

DigiKey

USA . 228 parts In-Stock

1+ parts

-

100+ parts

$7.450

1k+ parts

-

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228

-

$7.450

-

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Verical

USA . 228 parts In-Stock

1+ parts

-

100+ parts

$7.075

1k+ parts

$6.338

10k+ parts

$5.963

228

-

$7.075

$6.338

$5.963

Arrow

USA . 98 parts In-Stock

1+ parts

-

100+ parts

$5.859

1k+ parts

-

10k+ parts

-

98

-

$5.859

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,997 parts In-Stock

1+ parts

$5.976

100+ parts

-

1k+ parts

-

10k+ parts

-

1,997

$5.976

-

-

-

TME

Poland . 98 parts In-Stock

1+ parts

$9.840

100+ parts

-

1k+ parts

-

10k+ parts

-

98

$9.840

-

-

-

Freelance Electronics

USA . 19 parts In-Stock

1+ parts

$12.500

100+ parts

$13.125

1k+ parts

$12.375

10k+ parts

-

19

$12.500

$13.125

$12.375

-

Flip Electronics

USA . 108,957 parts In-Stock

1+ parts

-

100+ parts

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108,957

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Vyrian

USA . 2,784 parts In-Stock

1+ parts

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2,784

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

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500

-

-

-

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Sogenti Electronics

Canada . 104 parts In-Stock

1+ parts

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-

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104

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-

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Semi Source

USA . 54 parts In-Stock

1+ parts

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100+ parts

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54

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Speed Components Ltd

Israel . 33 parts In-Stock

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33

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LWI Electronics Inc

India . 15 parts In-Stock

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15

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Prism Electronics

USA . 6 parts In-Stock

1+ parts

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6

-

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Bristol Electronics

USA . 6 parts In-Stock

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6

-

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Flex Direct, LLC

USA . 6 parts In-Stock

1+ parts

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6

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 26,800 parts In-Stock

1+ parts

$4.980

100+ parts

-

1k+ parts

-

10k+ parts

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26,800

$4.980

-

-

-

Corphita

USA . 797 parts In-Stock

1+ parts

$5.661

100+ parts

-

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-

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797

$5.661

-

-

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Corohmni

South Africa . 89 parts In-Stock

1+ parts

$6.065

100+ parts

-

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89

$6.065

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Lixinc

USA . 10,082 parts In-Stock

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10,082

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Kulean Microsystems

USA . 6,282 parts In-Stock

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6,282

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TANS Electronics

Latvia . 4,486 parts In-Stock

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4,486

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Problanco Electronics

Mexico . 4,262 parts In-Stock

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4,262

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Perfect Parts

USA . 1,903 parts In-Stock

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1,903

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Speed Components Ltd (Excess)

Israel . 709 parts In-Stock

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709

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SupplyDigital Components

Austria . 619 parts In-Stock

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619

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UHIMA Technologies

Türkiye . 423 parts In-Stock

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423

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Netroflash

USA . 50 parts In-Stock

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50

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Kepictronics

USA . 46 parts In-Stock

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46

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GreenTree Electronics

Israel . 33 parts In-Stock

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33

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Overview

Upgrade your voltage level translation with the MC100EPT22DG by Onsemi. As a trusted manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. This voltage translator is perfect for applications requiring precise signal conversion, offering seamless integration and improved performance. With its advanced technology and industrial-grade design, the MC100EPT22DG provides customers with unmatched value, efficiency, and versatility. Say goodbye to compatibility issues and hello to smooth operations with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside the package.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages for flexibility in different applications.

No. of Functions: 2

Can perform multiple translation functions in a single package, increasing efficiency.

Package Shape: RECTANGULAR

Conforms to standard package shapes for compatibility and ease of integration.

Power Supplies (V): 3.3

Operates at a common power supply voltage for widespread compatibility.

No. of Terminals: 8

Provides multiple connection points for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on PCBs and allows for dense packing of components.

Minimum Supply Voltage: 3 V

Supports low voltage operation for energy efficiency and compatibility with different systems.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments without performance issues.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish for long-term performance.

Terminal Position: DUAL

Facilitates easy connection with other components and enables bidirectional communication.

Maximum Seated Height: 1.75 mm

Low profile design allows for compact integration and efficient use of space.

Width: 3.9 mm

Compact width enables placement in narrow areas on PCBs.

Output Polarity: COMPLEMENTARY

Produces complementary output signals for improved signal integrity and noise immunity.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for efficient assembly processes.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures for manufacturing processes.

Length: 4.9 mm

Compact length allows for efficient use of space on PCBs.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Technology: ECL

Utilizes ECL technology for high-speed and low-power operation.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections on PCBs.

Nominal Supply Voltage: 3.3 V

Operates at a standard supply voltage for compatibility with existing systems.

Maximum Delay: 0.7 ns

Offers minimal delay for fast and efficient signal translation.

Terminal Pitch: 1.27 mm

Terminal pitch allows for easy connection and facilitates high-density mounting.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

Enables translation between different logic levels for seamless communication between systems.

Technical Specifications

Voltage Level Translators MC100EPT22DG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.7 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100EPT22DG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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