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10H524/BFAJC

Onsemi

10H524/BFAJC by Onsemi

The Onsemi 10H524/BFAJC is a voltage level translator with 16 terminals in a ceramic, metal-sealed co-fired package. It features TTL to ECL translation and is surface mountable. Ideal for applications requiring precise signal conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,819 parts In-Stock

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Vyrian

USA . 1,180 parts In-Stock

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Resion

USA . 175 parts In-Stock

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175

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Electronics Depot

USA . 30 parts In-Stock

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30

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EZ Electronic Parts

Israel . 10 parts In-Stock

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10

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Distributors (Availability)

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Native Components

USA . 364 parts In-Stock

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$1.110

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364

$1.110

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Northwest PG Solutions

USA . 2,119 parts In-Stock

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$1.221

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$1.221

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Problanco Electronics

Mexico . 6,408 parts In-Stock

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Kulean Microsystems

USA . 4,220 parts In-Stock

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TANS Electronics

Latvia . 2,597 parts In-Stock

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Corphita

USA . 1,045 parts In-Stock

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Corohmni

South Africa . 333 parts In-Stock

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UHIMA Technologies

Türkiye . 251 parts In-Stock

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SupplyDigital Components

Austria . 115 parts In-Stock

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Overview

Experience seamless voltage translation with the 10H524/BFAJC by Onsemi. Crafted with precision and expertise, this voltage level translator offers unparalleled quality and reliability for a wide range of applications. From TTL to ECL translation, this versatile device ensures smooth and efficient signal conversion, making it an essential tool for electronics enthusiasts and professionals alike. Upgrade your projects with the 10H524/BFAJC and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for various environments and conditions.

Surface Mount: YES

Ease of installation and less space requirement, making it convenient for compact electronic designs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on PCBs, maximizing component placement and layout.

No. of Terminals: 16

Sufficient number of terminals for connecting multiple input and output lines, enhancing versatility and connectivity options.

Package Style (Meter): FLATPACK

Flatpack design enables easy integration into circuits or systems and provides a low profile for space-saving.

Terminal Position: DUAL

Dual terminal positions offer flexibility in installation and connection options, accommodating different circuit configurations.

Terminal Form: FLAT

Flat terminals provide stable and secure connections, ensuring reliable signal transmission and reducing the risk of electrical interference.

Interface IC Type: TTL TO ECL TRANSLATOR

Effective signal translation from TTL to ECL standards, enabling seamless communication between devices operating at different voltage levels.

Technical Specifications

Voltage Level Translators 10H524/BFAJC attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-CDFP-F16

No. of Terminals:

16

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

10H524/BFAJC Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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