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SN10KHT5564DW

Texas Instruments

SN10KHT5564DW by Texas Instruments

SN10KHT5564DW by Texas Instruments is an 8-function voltage level translator with a package style of small outline. It operates b/w 0-75°C, featuring 3-state output characteristics and inverted polarity. Ideal for TTL to ECL transceiver applications due to its ECL technology and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,827 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,827

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Vyrian

USA . 2,308 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,308

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,222 parts In-Stock

1+ parts

$2.063

100+ parts

-

1k+ parts

$2.583

10k+ parts

-

2,222

$2.063

-

$2.583

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DigiPath Technology Company

USA . 2,356 parts In-Stock

1+ parts

$2.272

100+ parts

-

1k+ parts

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10k+ parts

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2,356

$2.272

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ChromeModa Solutions

Germany . 5,925 parts In-Stock

1+ parts

$2.318

100+ parts

$1.901

1k+ parts

-

10k+ parts

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5,925

$2.318

$1.901

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IDEA Electronic Components Group

UK . 1,592 parts In-Stock

1+ parts

$2.318

100+ parts

-

1k+ parts

$2.086

10k+ parts

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1,592

$2.318

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$2.086

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AZTECH Wire

Italy . 822 parts In-Stock

1+ parts

$15.605

100+ parts

-

1k+ parts

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10k+ parts

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822

$15.605

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One Stop Electronics

USA . 914 parts In-Stock

1+ parts

$19.500

100+ parts

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10k+ parts

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914

$19.500

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Corphita

USA . 3,540 parts In-Stock

1+ parts

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100+ parts

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3,540

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Overview

Unlock new possibilities with the SN10KHT5564DW by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality voltage level translators that are essential for a wide range of applications. Whether you're working on IoT devices, automotive electronics, or industrial automation, this product offers unmatched value and performance. Say goodbye to compatibility issues and hello to seamless integration with the SN10KHT5564DW. Trust Texas Instruments for superior products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the components inside, ensuring long-term performance.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 8

Offers versatility and flexibility in voltage level translation, allowing for multiple input and output options.

Package Shape: RECTANGULAR

Fits well with standard circuit board layouts, making it compatible with various electronic devices.

No. of Terminals: 24

Provides ample connection points for interfacing with other components, enhancing signal transmission capabilities.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the circuit board, making it suitable for compact electronic devices.

Maximum Operating Temperature: 75 °C

Ensures stable performance even in high-temperature environments, suitable for a wide range of applications.

Output Characteristics: 3-STATE

Allows for high impedance state on the output, providing flexibility in signal control and routing.

Minimum Operating Temperature: 0 °C

Ensures reliable operation in low-temperature conditions, making it suitable for diverse environmental settings.

Terminal Position: DUAL

Facilitates easy and secure connection to other components, ensuring stable signal transmission.

Maximum Seated Height: 2.65 mm

Low profile design saves space on the circuit board and allows for compact device designs.

Width: 7.5 mm

Narrow width ensures compatibility with various circuit board layouts and space-constrained applications.

Output Polarity: INVERTED

Provides flexible signal inversion options, enhancing signal compatibility with different types of devices.

Length: 15.4 mm

Optimal length for fitting into standard circuit board configurations, ensuring easy integration.

Temperature Grade: COMMERCIAL EXTENDED

Suitable for commercial applications with extended temperature requirements, ensuring reliable performance.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed and low-power operation, ideal for fast data transmission.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connection to the circuit board, ensuring long-term performance.

Maximum Delay: 0 ns

Offers instantaneous signal processing, reducing latency in data transmission for efficient operation.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and connection, ensuring quick and reliable assembly.

Interface IC Type: TTL TO ECL TRANSCEIVER

Specifically designed for TTL to ECL signal translation, providing seamless communication between different voltage levels.

Technical Specifications

Voltage Level Translators SN10KHT5564DW attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

0 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN10KHT5564DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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