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SN100KT5562DWR

Texas Instruments

SN100KT5562DWR by Texas Instruments

SN100KT5562DWR by Texas Instruments is an 8-function voltage level translator with a package style of small outline. Operating b/w 0°C to 85°C, it features a TTL to ECL transceiver interface IC type and output characteristics in 3-state. Ideal for applications requiring true output polarity and dual terminal position, this device offers reliable performance in compact dimensions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,682 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,682

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-

-

-

Digiode

USA . 4,484 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,484

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 406 parts In-Stock

1+ parts

$3.402

100+ parts

$315.888

1k+ parts

$3.061

10k+ parts

-

406

$3.402

$315.888

$3.061

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DigiPath Technology Company

USA . 1,924 parts In-Stock

1+ parts

$3.746

100+ parts

$3.446

1k+ parts

-

10k+ parts

-

1,924

$3.746

$3.446

-

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IDEA Electronic Components Group

UK . 1,854 parts In-Stock

1+ parts

$3.822

100+ parts

-

1k+ parts

$3.440

10k+ parts

-

1,854

$3.822

-

$3.440

-

ChromeModa Solutions

Germany . 248 parts In-Stock

1+ parts

$3.822

100+ parts

$3.134

1k+ parts

-

10k+ parts

-

248

$3.822

$3.134

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-

One Stop Electronics

USA . 926 parts In-Stock

1+ parts

$11.500

100+ parts

-

1k+ parts

-

10k+ parts

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926

$11.500

-

-

-

AZTECH Wire

Italy . 680 parts In-Stock

1+ parts

$14.532

100+ parts

-

1k+ parts

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10k+ parts

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680

$14.532

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-

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Corphita

USA . 222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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222

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Overview

Enhance your electronic designs with the SN100KT5562DWR by Texas Instruments, a top-quality voltage level translator that offers unmatched performance and reliability. With Texas Instruments' reputation for excellence in the industry, this product is designed to meet the demands of various applications. Its 3-state output characteristics and true output polarity provide added flexibility and functionality. Experience seamless integration and improved efficiency with this versatile solution. Unlock the full potential of your projects with the SN100KT5562DWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for long-lasting use.

Surface Mount: YES

Allows for easy integration onto circuit boards, making installation and assembly processes more efficient.

No. of Functions: 8

This product can handle multiple functions simultaneously, offering versatility and flexibility in various applications.

Package Shape: RECTANGULAR

Rectangular shape provides efficient use of space and easy placement within electronic devices.

No. of Terminals: 24

Having a higher number of terminals allows for more connections and compatibility with different systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and enables compact designs in electronic equipment.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can function reliably in various environmental conditions.

Output Characteristics: 3-STATE

The 3-STATE output characteristics offer flexibility in controlling the output signal, providing different output states for various applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can perform effectively even in colder environments.

Terminal Position: DUAL

Having dual terminal position enhances connectivity options and allows for more versatile installation possibilities.

Maximum Seated Height: 2.65 mm

The low maximum seated height ensures compatibility with slim and compact electronic devices.

Width: 7.5 mm

The narrow width makes the product suitable for applications where space is limited.

Output Polarity: TRUE

True output polarity ensures accurate and reliable signal transmission in different circuit configurations.

Length: 15.4 mm

The moderate length offers a balanced form factor that can fit well within different electronic setups.

Technology: ECL

The ECL technology enables high-speed operation and efficient signal processing for demanding applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical connection and ease of soldering for reliable assembly.

Terminal Pitch: 1.27 mm

The precise terminal pitch allows for accurate placement and alignment during installation, ensuring proper connectivity.

Interface IC Type: TTL TO ECL TRANSCEIVER

The TTL to ECL transceiver interface IC type ensures seamless signal conversion and communication between different logic levels.

Technical Specifications

Voltage Level Translators SN100KT5562DWR attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN100KT5562DWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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