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SN10KHT5538DW

Texas Instruments

SN10KHT5538DW by Texas Instruments

SN10KHT5538DW by Texas Instruments is an ECL to TTL translator with 8 functions, operating at a voltage range of 4.5V to 5.5V. It features open-collector output polarity and has a max delay of 11.7ns, making it ideal for commercial temperature grade applications requiring voltage level translation in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,465 parts In-Stock

1+ parts

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6,465

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Digiode

USA . 875 parts In-Stock

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875

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Distributors (Availability)

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Parana Technologies

USA . 2,165 parts In-Stock

1+ parts

$8.488

100+ parts

-

1k+ parts

$9.142

10k+ parts

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2,165

$8.488

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$9.142

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DigiPath Technology Company

USA . 2,284 parts In-Stock

1+ parts

$9.346

100+ parts

$8.599

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2,284

$9.346

$8.599

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IDEA Electronic Components Group

UK . 1,792 parts In-Stock

1+ parts

$9.537

100+ parts

$9.060

1k+ parts

$8.583

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1,792

$9.537

$9.060

$8.583

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ChromeModa Solutions

Germany . 1,504 parts In-Stock

1+ parts

$9.537

100+ parts

$7.820

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1,504

$9.537

$7.820

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One Stop Electronics

USA . 1,241 parts In-Stock

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$13.500

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1,241

$13.500

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AZTECH Wire

Italy . 338 parts In-Stock

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$18.776

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338

$18.776

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Ampacity Inc.

Singapore . 563 parts In-Stock

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$21.500

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563

$21.500

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Corphita

USA . 4,319 parts In-Stock

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4,319

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Overview

Unlock new possibilities with the SN10KHT5538DW from Texas Instruments, a leading manufacturer known for top-quality voltage level translators. This versatile device, with 8 functions and open-collector output characteristics, is perfect for a wide range of applications. Experience seamless voltage translation with this small outline package that offers inverted output polarity and dual terminal position. Trust in the reliability and performance of Texas Instruments products to take your projects to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection for the components inside the package.

Surface Mount: YES

Easy to mount and integrate into circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 8

Offers multiple functions in a single device, saving space and cost in circuit design.

Package Shape: RECTANGULAR

Convenient shape for fitting into standard circuit layouts.

Power Supplies (V): 5,-5.2

Supports both positive and negative supply voltages, suitable for various system configurations.

No. of Terminals: 24

Sufficient terminals for connecting to other components and peripherals in a circuit.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the circuit board and allows for denser layouts.

Minimum Supply Voltage: 4.5 V

Can operate reliably even at low supply voltage levels, ensuring stability in different conditions.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, suitable for industrial and automotive applications.

Output Characteristics: OPEN-COLLECTOR

Allows for easy interfacing with other devices and signal processing circuits.

Minimum Operating Temperature: 0 °C

Can operate in cold environments without compromising performance.

Terminal Position: DUAL

Dual terminal position allows for flexible connection options in the circuit layout.

Maximum Seated Height: 2.65 mm

Low profile design for space-saving and compatibility with compact enclosures.

Width: 7.5 mm

Narrow width for fitting into tight spaces on the circuit board.

Output Polarity: INVERTED

Inverted output polarity for compatibility with various logic levels and signal processing requirements.

Length: 15.4 mm

Compact length for easy integration into circuit board layouts.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications and environments.

Technology: BIPOLAR

Bipolar technology for fast switching speeds and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and reliable connections.

Maximum Supply Current: 114 mA

Can handle high supply currents for driving multiple loads or components in the circuit.

Input Characteristics: STANDARD

Standard input characteristics for easy integration with existing circuits.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage for compatibility with most digital systems.

Nominal Negative Supply Voltage: -5.2 V

Provides a stable negative supply voltage for proper signal processing and biasing.

Maximum Delay: 11.7 ns

Low delay for fast signal processing and minimal signal distortion.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy connection and compatibility with standard connectors.

Interface IC Type: ECL TO TTL TRANSLATOR

Specific interface IC type for translating signals between different logic families, ensuring compatibility.

Technical Specifications

Voltage Level Translators SN10KHT5538DW attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

11.7 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Latch/Register:

NONE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Level Translators

Maximum Supply Current:

114 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN10KHT5538DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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