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MC10ELT20MNR4

Onsemi

MC10ELT20MNR4 by Onsemi

MC10ELT20MNR4 by Onsemi is a voltage level translator with max supply voltage of 5.25V, operating temp range -40 to 85 °C, and max delay of 1.25ns. It's used as TTL/CMOS to PECL translator in industrial applications due to ECL technology and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 960 parts In-Stock

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Digiode

USA . 160 parts In-Stock

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Problanco Electronics

Mexico . 6,799 parts In-Stock

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TANS Electronics

Latvia . 4,359 parts In-Stock

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Kulean Microsystems

USA . 3,301 parts In-Stock

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Corphita

USA . 2,383 parts In-Stock

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UHIMA Technologies

Türkiye . 644 parts In-Stock

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SupplyDigital Components

Austria . 417 parts In-Stock

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Corohmni

South Africa . 87 parts In-Stock

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Overview

Unlock seamless voltage level translation with the MC10ELT20MNR4 by Onsemi. This cutting-edge product is designed to provide reliable performance and superior quality, ensuring precision in a wide range of applications. With its compact design and advanced technology, this voltage translator offers unmatched value and benefits to customers looking for efficient solutions. Trust Onsemi to deliver innovative products that meet your needs and exceed your expectations. Elevate your projects with the MC10ELT20MNR4 today.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to integrate into surface mount applications for compact and efficient design.

Maximum Supply Voltage: 5.25 V

Allows for compatibility with a wide range of supply voltages.

Package Shape: SQUARE

Provides a standardized shape for easier mounting and handling.

Power Supplies (V): 5

Operates at a common power supply voltage, ensuring compatibility with existing systems.

No. of Terminals: 8

Provides multiple connection points for flexible integration.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Offers a compact and efficient package design for space-constrained applications.

Minimum Supply Voltage: 4.75 V

Allows for operation at lower supply voltages to conserve power.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without performance degradation.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments without issue.

Terminal Finish: TIN LEAD

Provides a reliable and durable terminal finish for long-term use.

Terminal Position: DUAL

Offers flexibility in connection options for different system configurations.

Maximum Seated Height: 1 mm

Low profile design allows for a compact layout and reduces board space requirements.

Width: 2 mm

Narrow width makes it suitable for applications with tight spacing constraints.

Output Polarity: COMPLEMENTARY

Provides a balanced signal output for improved noise immunity.

Length: 2 mm

Compact length allows for efficient use of board space.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with reliable performance.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed and low-power operation.

Terminal Form: NO LEAD

Eliminates lead-based soldering for environmentally friendly and RoHS-compliant assembly.

Nominal Supply Voltage: 5 V

Operates at the standard 5V supply voltage for easy integration into existing systems.

Maximum Delay: 1.25 ns

Provides fast signal translation with minimal delay for efficient data transfer.

Terminal Pitch: 0.5 mm

Offers fine pitch terminals for precise connection and compatibility with modern PCB designs.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

Facilitates seamless signal translation between different logic families for improved compatibility.

Technical Specifications

Voltage Level Translators MC10ELT20MNR4 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

1.25 ns

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

2 mm

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC10ELT20MNR4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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