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SN100KT5543DWR

Texas Instruments

SN100KT5543DWR by Texas Instruments

SN100KT5543DWR by Texas Instruments is a voltage level translator with 8 functions, operating b/w 4.5V to 5.5V. It features a small outline package style, with output polarity as TRUE and max delay of 3.6ns. Ideal for TTL to ECL translation applications due to its compact size and high-speed performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,290 parts In-Stock

1+ parts

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4,290

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Digiode

USA . 2,957 parts In-Stock

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2,957

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,898 parts In-Stock

1+ parts

$11.481

100+ parts

-

1k+ parts

$11.894

10k+ parts

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1,898

$11.481

-

$11.894

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ChromeModa Solutions

Germany . 6,937 parts In-Stock

1+ parts

$12.900

100+ parts

$10.578

1k+ parts

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6,937

$12.900

$10.578

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IDEA Electronic Components Group

UK . 5 parts In-Stock

1+ parts

$12.900

100+ parts

$12.255

1k+ parts

$11.610

10k+ parts

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5

$12.900

$12.255

$11.610

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AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$13.904

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460

$13.904

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One Stop Electronics

USA . 1,512 parts In-Stock

1+ parts

$31.500

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1,512

$31.500

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Corphita

USA . 4,039 parts In-Stock

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4,039

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DigiPath Technology Company

USA . 1,187 parts In-Stock

1+ parts

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100+ parts

$11.631

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1,187

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$11.631

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Overview

Elevate your voltage level translation needs with the SN100KT5543DWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that excel in performance and reliability. This versatile voltage level translator is perfect for a wide range of applications, offering seamless integration and efficient functionality. Say goodbye to compatibility issues and hello to smooth operation with the SN100KT5543DWR. Upgrade your systems today and experience the unparalleled value and benefits this product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external damage, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability makes installation and integration easier, especially in compact electronic setups.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage allows the product to handle various voltage inputs without risking damage.

No. of Functions: 8

Having 8 functions in one device provides versatility and flexibility in voltage translation requirements.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and mounting on circuit boards or other surfaces.

No. of Terminals: 24

Having 24 terminals offers ample connectivity options for different input and output configurations.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature enables the product to function reliably in various environmental conditions.

Output Characteristics: 3-STATE

3-STATE output characteristics allow for high impedance state when disabled, reducing power consumption and preventing signal conflicts.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can operate in colder environments without issues.

Terminal Position: DUAL

Dual terminal position provides added stability and secure connection points for reliable performance.

Maximum Seated Height: 2.65 mm

Low maximum seated height enables the product to be used in space-constrained applications or compact electronic devices.

Width: 7.5 mm

Narrow width allows for efficient use of space on circuit boards or in electronic assemblies.

Output Polarity: TRUE

True output polarity ensures accurate voltage translation and compatibility with various signal types.

Length: 15.4 mm

Compact length makes this product suitable for use in small devices or tight spaces.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical connections and ease of soldering during installation.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5V ensures consistent performance and compatibility with standard power sources.

Nominal Negative Supply Voltage: -4.5 V

Negative supply voltage compatibility allows for bidirectional voltage translation capabilities.

Maximum Delay: 3.6 ns

Low maximum delay ensures quick response times for voltage translation, minimizing signal lag in the system.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27mm enables easy connections to other components or PCBs with matching pitch.

Interface IC Type: TTL TO ECL TRANSLATOR

Specific interface IC type ensures seamless translation between TTL and ECL signal levels, enhancing compatibility in mixed-signal systems.

Technical Specifications

Voltage Level Translators SN100KT5543DWR attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

3.6 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Nominal Negative Supply Voltage:

-4.5 V

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN100KT5543DWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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