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MC10H125PD

Onsemi

MC10H125PD by Onsemi

MC10H125PD by Onsemi is a voltage level translator with 16 terminals, operating at temperatures from 0 to 70 °C. It features ECL technology, dual terminal position, and interfaces as an ECL to TTL translator. This rectangular package in plastic/epoxy material has power supplies of 5V and -5.2V, making it ideal for commercial applications requiring precise signal translation.

Median Price

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Lifecycle Status

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In-Stock Inventory

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Digiode

USA . 1,636 parts In-Stock

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LWI Electronics Inc

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Electronic Expediters

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Electronics Depot

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Resion

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Kulean Microsystems

USA . 7,207 parts In-Stock

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SupplyDigital Components

Austria . 5,252 parts In-Stock

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Problanco Electronics

Mexico . 3,744 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 819 parts In-Stock

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Overview

Elevate your voltage level translation needs with the MC10H125PD by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This versatile device is perfect for a wide range of applications, offering seamless translation between ECL and TTL interfaces. Say goodbye to compatibility issues and hello to smooth operation with the MC10H125PD. Trust Onsemi to deliver exceptional performance and value with every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the voltage level translator.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement on a circuit board or in an electronic system.

Power Supplies (V): 5,-5.2

Support for multiple power supply voltages allows for versatile compatibility with different systems and applications.

No. of Terminals: 16

Having 16 terminals provides ample connection points for interfacing with various components in a circuit.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in a wide range of temperature settings.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish ensures good electrical conductivity and solderability for secure connections.

Technology: ECL

The ECL technology used in this voltage level translator offers high-speed operation and low power consumption.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a strong and reliable connection with the circuit board.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy and secure soldering of the terminals onto a PCB.

Interface IC Type: ECL TO TTL TRANSLATOR

The ECL to TTL translator interface IC type enables seamless communication between different logic levels in a circuit.

Technical Specifications

Voltage Level Translators MC10H125PD attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,-5.2

Sub-Category:

Level Translators

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

MC10H125PD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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