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NVT2006BS

NXP Semiconductors

NVT2006BS by NXP Semiconductors

NVT2006BS by NXP Semiconductors is a 6-bit voltage level translator with a max supply voltage of 5.5V and operates in temperatures from -40 °C to 85 °C. Its compact, no-lead design makes it ideal for space-constrained applications. Perfect for interfacing different logic levels in industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 2,205 parts In-Stock

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Digiode

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PC Components Company LLC

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Bristol Electronics

USA . 1,200 parts In-Stock

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Anansix

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Microfarads

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One Stop Electronics

USA . 931 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,166 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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UNI Independent Distributors

Spain . 2,610 parts In-Stock

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Kepictronics

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Overview

Unlock seamless connectivity with the NVT2006BS from NXP Semiconductors, a leader in innovative solutions. This high-quality voltage level translator effortlessly bridges different logic levels, ensuring reliable communication in diverse applications—from automotive to industrial systems. With its compact design and robust temperature range, it delivers exceptional performance and durability, empowering your products with enhanced flexibility and efficiency. Trust NXP for cutting-edge technology that elevates your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, facilitating modern electronics assembly.

Maximum Supply Voltage: 3.6 V

This voltage rating allows compatibility with a wide range of low-power devices, making it versatile for different applications.

Package Shape: SQUARE

The square package shape optimizes layout in printed circuit boards, supporting efficient design and manufacturing processes.

No. of Bits: 6

Having 6 bits provides flexibility in supporting multiple data lines, enhancing the capabilities of the device it interfaces with.

Maximum Supply Voltage-1: 5.5 V

Supporting a higher voltage increases its applicability, allowing it to interface with both 3.3V and 5V systems seamlessly.

No. of Terminals: 16

A higher number of terminals facilitates more connections for complex systems, enhancing its usability in demanding applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile is ideal for space-constrained applications, while the heat sink/slugs aid in thermal management.

Minimum Supply Voltage-1: 1.8 V

Low minimum voltage enhances compatibility with low-power devices, improving flexibility in diverse environments.

Minimum Supply Voltage: 1 V

This allows the translator to operate effectively in extremely low-power applications, making it energy efficient.

Maximum Operating Temperature: 85 °C

An elevated operating temperature rating ensures reliability in high-temperature environments, enhancing product longevity.

Output Characteristics: OPEN-EMITTER

Open-emitter outputs facilitate greater control in digital interfacing scenarios, providing flexibility in design.

Minimum Operating Temperature: -40 °C

The low operating temperature ensures functionality in extreme conditions, making it suitable for industrial applications.

Terminal Position: QUAD

Quad terminal positioning optimizes space utilization and simplifies PCB layout, improving circuit design efficiency.

Maximum Seated Height: 1 mm

A low seated height promotes compact designs and compatibility with other components in space-restricted scenarios.

Width: 3 mm

The narrow width allows for high-density designs on printed circuit boards, making it suitable for miniaturized applications.

Output Polarity: TRUE

True output polarity simplifies integration with digital logic levels, enhancing compatibility with existing systems.

Length: 3 mm

Short length contributes to space saving on PCBs, which is advantageous in small electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading assures performance and reliability in challenging environments, suitable for demanding applications.

Terminal Form: NO LEAD

No lead configuration reduces footprint and enhances reliability, while also aligning with modern lead-free initiatives.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for greater density in PCB designs, enabling more compact and innovative layouts.

Interface IC Type: VOLTAGE LEVEL TRANSLATOR

Designed specifically as a voltage level translator, it ensures efficient data communication between different voltage systems, enhancing interoperability.

Technical Specifications

Voltage Level Translators NVT2006BS attributes and parameters. Explore more Voltage Level Translators devices from NXP Semiconductors

Specs

Additional Features:

TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE

Interface IC Type:

JESD-30 Code:

S-PQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NVT2006BS Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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