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NVT2006PW

NXP Semiconductors

NVT2006PW by NXP Semiconductors

NVT2006PW by NXP Semiconductors is a 6-bit voltage level translator with a max supply voltage of 5.5V and operates b/w -40 °C to 85 °C. Its compact SOIC package (4.4mm x 5mm) supports surface mounting for space-constrained applications. Ideal for interfacing different logic levels in industrial systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,230 parts In-Stock

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Digiode

USA . 3,431 parts In-Stock

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3,431

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Anansix

USA . 1,214 parts In-Stock

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1,214

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 736 parts In-Stock

1+ parts

$20.500

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736

$20.500

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UNI Independent Distributors

Spain . 1,270 parts In-Stock

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Corphita

USA . 1,134 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Unlock seamless communication between different voltage systems with the NVT2006PW from NXP Semiconductors. Renowned for its quality and reliability, NXP ensures that you receive a top-tier product designed for a wide range of applications, from automotive to industrial automation. With its compact form and robust performance, the NVT2006PW simplifies design challenges while enhancing system efficiency, delivering unmatched value and peace of mind for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs, reducing board space requirements.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of devices operating at lower voltage levels.

Package Shape: RECTANGULAR

The rectangular package shape provides a stable form factor for mounting, ensuring ease of handling and assembly.

No. of Bits: 6

With 6 bits, this device can effectively handle multiple data lines, making it suitable for various applications in digital communications.

Maximum Supply Voltage-1: 5.5 V

The ability to accept up to 5.5 V makes this device versatile for interfacing with higher voltage logic levels.

No. of Terminals: 16

Having 16 terminals allows for multiple connections, providing flexibility for various circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style is ideal for modern electronics, enabling high-density and space-efficient designs.

Minimum Supply Voltage-1: 1.8 V

With a minimum supply voltage of 1.8 V, this product can be used in low-power applications, enhancing energy efficiency.

Minimum Supply Voltage: 1 V

The lowest supply voltage of 1 V underscores its suitability for ultra-low power applications, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in industrial environments where heat tolerance is crucial.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics facilitate easy interfacing with other devices, promoting versatility in application.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C guarantees performance in extreme conditions, making it suitable for outdoor or harsh environments.

Terminal Position: DUAL

Dual terminal position improves flexibility for PCB layout design, allowing engineers to optimize space and connectivity.

Maximum Seated Height: 1.1 mm

A low seated height of 1.1 mm contributes to a slim profile in electronic assemblies, ideal for space-constrained applications.

Width: 4.4 mm

The compact width ensures that the device can fit into tight spaces on PCBs, enhancing design versatility.

Output Polarity: TRUE

True output polarity implies reliable logic state representation, ensuring consistent performance in logic level translation.

Length: 5 mm

With a length of 5 mm, this component can facilitate efficient PCB layout designs without compromising on performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures the device's reliability in demanding industrial applications, enhancing longevity.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering stability, ensuring robust connections in electronic assemblies.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm supports high-density mounting, making the product suitable for modern compact electronic designs.

Interface IC Type: VOLTAGE LEVEL TRANSLATOR

As a dedicated voltage level translator, this IC simplifies interfacing between components operating at different voltage levels, enhancing design compatibility.

Technical Specifications

Voltage Level Translators NVT2006PW attributes and parameters. Explore more Voltage Level Translators devices from NXP Semiconductors

Specs

Additional Features:

TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

NVT2006PW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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