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MC10H124MEL

Onsemi

MC10H124MEL by Onsemi

MC10H124MEL by Onsemi is a voltage level translator with 4 functions, operating at 5.25V max supply voltage and -5.2V min supply voltage. It has a package style of small outline and is used as a TTL to ECL translator in commercial extended temperature applications.

Median Price

$4.252

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 744 parts In-Stock

1+ parts

-

100+ parts

$3.780

1k+ parts

$3.380

10k+ parts

$3.180

744

-

$3.780

$3.380

$3.180

Verical

USA . 744 parts In-Stock

1+ parts

-

100+ parts

$4.725

1k+ parts

$4.225

10k+ parts

$3.975

744

-

$4.725

$4.225

$3.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 405 parts In-Stock

1+ parts

$3.700

100+ parts

-

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-

10k+ parts

-

405

$3.700

-

-

-

Digiode

USA . 1,568 parts In-Stock

1+ parts

$4.000

100+ parts

-

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1,568

$4.000

-

-

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ACDS - Activité Composants Distribution Service

France . 1,896 parts In-Stock

1+ parts

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1,896

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Bristol Electronics

USA . 1,896 parts In-Stock

1+ parts

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1,896

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Dan-Mar Components

USA . 1,896 parts In-Stock

1+ parts

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1,896

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 244 parts In-Stock

1+ parts

$3.700

100+ parts

-

1k+ parts

-

10k+ parts

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244

$3.700

-

-

-

Corphita

USA . 2,121 parts In-Stock

1+ parts

$3.789

100+ parts

-

1k+ parts

-

10k+ parts

-

2,121

$3.789

-

-

-

Kulean Microsystems

USA . 7,201 parts In-Stock

1+ parts

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100+ parts

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7,201

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TANS Electronics

Latvia . 6,161 parts In-Stock

1+ parts

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6,161

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Kepictronics

USA . 4,500 parts In-Stock

1+ parts

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4,500

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Problanco Electronics

Mexico . 3,015 parts In-Stock

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3,015

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SupplyDigital Components

Austria . 2,893 parts In-Stock

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2,893

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Assy Fe

Spain . 2,000 parts In-Stock

1+ parts

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2,000

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Continental Prestige Electronics

USA . 744 parts In-Stock

1+ parts

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100+ parts

$3.730

1k+ parts

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10k+ parts

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744

-

$3.730

-

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UHIMA Technologies

Türkiye . 537 parts In-Stock

1+ parts

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537

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Microchip USA

USA . 309 parts In-Stock

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309

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Overview

Discover the cutting-edge MC10H124MEL voltage level translator by Onsemi, a high-quality product that promises reliable performance and seamless communication between TTL and ECL devices. Perfect for a wide range of applications, this compact device offers customers unmatched value, with its advanced technology ensuring fast and accurate signal translation. Trust in Onsemi's reputation for excellence and elevate your electronics projects with the MC10H124MEL. Get yours today and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for a wide range of input voltage levels, increasing flexibility in usage.

No. of Functions: 4

Having multiple functions in a single device reduces the need for additional components, simplifying the design and saving space.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliability in diverse environmental conditions.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, the product can withstand elevated temperatures without performance degradation.

Technology: ECL

The Emitter-Coupled Logic technology provides high-speed and low-power operation, making it ideal for high-performance applications.

Technical Specifications

Voltage Level Translators MC10H124MEL attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.1 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H124MEL Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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